发明授权
- 专利标题： Adhesive material
- 专利标题（中）： 胶粘材料
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申请号： US14135849申请日： 2013-12-20
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公开(公告)号： US09340712B2公开(公告)日： 2016-05-17
- 发明人: Kuo Hsun Chen , Meng Chun Ko , Yi An Sha , Hsiang Yun Yang
- 申请人： Kuo Hsun Chen , Meng Chun Ko , Yi An Sha , Hsiang Yun Yang
- 申请人地址： TW Hsinchu
- 专利权人： POLYTRONICS TECHNOLOGY CORP.
- 当前专利权人： POLYTRONICS TECHNOLOGY CORP.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Egbert Law Offices, PLLC
- 优先权： TW102121676A 20130619
- 主分类号： C09J11/04
- IPC分类号： C09J11/04 ; C09J163/00 ; C09J113/00 ; C09J11/06 ; C09J163/02 ; C09J163/04 ; C09J171/12 ; C09J7/00 ; C08G59/40 ; C08G59/50 ; H01L33/64 ; H05K7/20 ; C09J109/02 ; C08K3/22 ; C08K3/28
摘要：
An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.
公开/授权文献
- US20140374649A1 ADHESIVE MATERIAL 公开/授权日：2014-12-25
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