发明授权
US09341792B2 Vent structures for encapsulated components on an SOI-based photonics platform
有权
基于SOI的光子平台上封装元件的通气结构
- 专利标题： Vent structures for encapsulated components on an SOI-based photonics platform
- 专利标题（中）： 基于SOI的光子平台上封装元件的通气结构
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申请号： US13154699申请日： 2011-06-07
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公开(公告)号： US09341792B2公开(公告)日： 2016-05-17
- 发明人: Mary Nadeau , John Fangman , Duane Stackhouse , Craig Young , David Piede , Vipulkumar Patel
- 申请人： Mary Nadeau , John Fangman , Duane Stackhouse , Craig Young , David Piede , Vipulkumar Patel
- 申请人地址： US CA San Jose
- 专利权人： CISCO TECHNOLOGY, INC.
- 当前专利权人： CISCO TECHNOLOGY, INC.
- 当前专利权人地址： US CA San Jose
- 代理机构： Patterson + Sheridan, LLP
- 主分类号： G02B6/12
- IPC分类号： G02B6/12 ; G02B6/42 ; H01S5/022 ; H01S5/0683
摘要：
An silicon-on-insulator (SOI)-based photonics platform is formed to including a venting structure for encapsulating the active and passive optical components formed on the SOI-based photonics platform. The venting structure is used to allow for the encapsulated components to “breathe” such that water vapor and gasses will pass through the package and not condensate on any of the encapsulated optical surfaces. The venting structure is configured to also to prevent dust, liquids and other particulate material from entering the package.
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