利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

12 条记录 (耗时 0.022 秒)

    Vertical stacking of multiple integrated circuits including SOI-based optical components
    3.
    发明申请
    Vertical stacking of multiple integrated circuits including SOI-based optical components 审中-公开
    包括基于SOI的光学元件的多个集成电路的垂直堆叠

    公开(公告)号：US20060177173A1

    公开(公告)日：2006-08-10

    申请号：US11346718

    申请日：2006-02-03

    申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  David Piede ,  John Fangman

    发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  David Piede ,  John Fangman

    IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/42 ,  G02B6/10

    CPC分类号： G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02F1/025 ,  H01L31/12

    摘要： A vertical stack of integrated circuits includes at least one CMOS electronic integrated circuit (IC), an SOI-based opto-electronic integrated circuit structure, and an optical input/output coupling element. A plurality of metalized vias may be formed through the thickness of the stack so that electrical connections can be made between each integrated circuit. Various types of optical input/output coupling can be used, such as prism coupling, gratings, inverse tapers, and the like. By separating the optical and electrical functions onto separate ICs, the functionalities of each may be modified without requiring a re-design of the remaining system. By virtue of using SOI-based opto-electronics with the CMOS electronic ICs, a portion of the SOI structure may be exposed to provide access to the waveguiding SOI layer for optical coupling purposes.

    摘要翻译： 集成电路的垂直堆叠包括至少一个CMOS电子集成电路（IC），基于SOI的光电集成电路结构以及光输入/输出耦合元件。 可以通过堆叠的厚度形成多个金属化通孔，使得可以在每个集成电路之间进行电连接。 可以使用各种类型的光输入/输出耦合，例如棱镜耦合，光栅，逆锥等。 通过将光学和电气功能分离到单独的IC上，可以修改每个功能，而不需要重新设计剩余的系统。 通过使用具有CMOS电子IC的基于SOI的光电子器件，SOI结构的一部分可能被暴露以提供对波导SOI层的访问以用于光学耦合目的。

    Optical Components Including Bonding Slots For Adhesion Stability
    6.
    发明申请
    Optical Components Including Bonding Slots For Adhesion Stability 有权
    包括粘合槽的光学部件用于粘附稳定性

    公开(公告)号：US20130183010A1

    公开(公告)日：2013-07-18

    申请号：US13742483

    申请日：2013-01-16

    申请人： John Fangman ,  Vipulkumar Patel ,  Ravinder Kachru

    发明人： John Fangman ,  Vipulkumar Patel ,  Ravinder Kachru

    IPC分类号： G02B6/36 ,  B32B37/12 ,  G02B6/32

    CPC分类号： G02B6/36 ,  B32B37/1292 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/4244 ,  G02B6/4246

    摘要： An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.

    摘要翻译： 光电设备包括用于支撑形成光电组件的多个部件的基板和用粘合剂材料（例如焊料或环氧树脂）附接到基板的光学部件。 光学部件被形成为包括平行地布置在光学部件的底表面的至少一部分上的多个接合槽，多个接合槽提供用于液体粘合剂材料的路径并且提高了使液体移位的能力 作为组分的粘合剂材料在附着过程中被压入基材的表面。

    Releasable Fiber Connector For Opto-Electronic Assemblies
    7.
    发明申请
    Releasable Fiber Connector For Opto-Electronic Assemblies 有权
    用于光电子组件的可释放光纤连接器

    公开(公告)号：US20130182996A1

    公开(公告)日：2013-07-18

    申请号：US13737029

    申请日：2013-01-09

    申请人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

    发明人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

    IPC分类号： G02B6/42 ,  G02B6/12

    CPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/3886 ,  G02B6/4214 ,  G02B6/4259 ,  G02B6/4292 ,  Y10T29/49155

    摘要： An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.

    摘要翻译： 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。

    Passive fiber alignment arrangement for coupling to nano-taper optical waveguides
    9.
    发明授权
    Passive fiber alignment arrangement for coupling to nano-taper optical waveguides 有权
    用于耦合到纳米锥形光波导的无源光纤对准布置

    公开(公告)号：US07373052B2

    公开(公告)日：2008-05-13

    申请号：US11799577

    申请日：2007-05-02

    申请人： Mary Nadeau ,  John Fangman

    发明人： Mary Nadeau ,  John Fangman

    IPC分类号： G02B6/26 ,  G02B6/30

    CPC分类号： G02B6/423

    摘要： An arrangement for providing passive alignment between an optical fiber and the “tip” of a nanotaper coupling waveguide (the nanotaper formed within the SOI layer of an SOI-based optoelectronic arrangement). The arrangement includes a separate fiber carrier support element, including a longitudinal V-groove for supporting the fiber and an alignment feature formed parallel thereto. The SOI structure is formed to include an associated alignment slot, so that as the fiber carrier is positioned over and attached to the SOI structure, the alignment feature and alignment slot will mate together and provide passive alignment of the optical fiber to the nanotaper waveguide tip.

    摘要翻译： 一种用于在光纤与纳米锥耦合波导（在基于SOI的光电子装置的SOI层内形成的纳米锥）的“尖端”之间提供被动对准的装置。 该装置包括单独的纤维载体支撑元件，其包括用于支撑纤维的纵向V形槽和与其平行形成的对准特征。 SOI结构被形成为包括相关联的对准槽，使得当光纤载体定位在SOI结构上并附着到SOI结构时，对准特征和对准槽将配合在一起并且提供光纤到纳米孔波导尖端的被动对准 。

    Wideband optical coupling into thin SOI CMOS photonic integrated circuit
    10.
    发明申请
    Wideband optical coupling into thin SOI CMOS photonic integrated circuit 有权
    宽带光耦合成薄SOI CMOS光子集成电路

    公开(公告)号：US20070274630A1

    公开(公告)日：2007-11-29

    申请号：US11652348

    申请日：2007-01-11

    申请人： Margaret Ghiron ,  Prakash Gothoskar ,  John Fangman ,  Robert Montgomery ,  Mary Nadeau

    发明人： Margaret Ghiron ,  Prakash Gothoskar ,  John Fangman ,  Robert Montgomery ,  Mary Nadeau

    IPC分类号： G02B6/26

    CPC分类号： G02B6/4231

    摘要： An arrangement for providing optical coupling into and out of a relatively thin silicon waveguide formed in the SOI layer of an SOI structure includes a lensing element and a defined reference surface within the SOI structure for providing optical coupling in an efficient manner. The input to the waveguide may come from an optical fiber or an optical transmitting device (laser). A similar coupling arrangement may be used between a thin silicon waveguide and an output fiber (either single mode fiber or multimode fiber).

    摘要翻译： 用于在SOI结构的SOI层中形成的相对薄的硅波导提供光耦合的装置包括在SOI结构内的透镜元件和限定的参考表面，用于以有效的方式提供光耦合。 波导的输入可以来自光纤或光发射装置（激光）。 可以在薄硅波导和输出光纤（单模光纤或多模光纤）之间使用类似的耦合布置。