Invention Grant
- Patent Title: Stud bump bonding in implantable medical devices
- Patent Title (中): 可植入式医疗器械中的凸块接合
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Application No.: US13790141Application Date: 2013-03-08
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Publication No.: US09351436B2Publication Date: 2016-05-24
- Inventor: Milind Raje , Robert Bennett , Andrew Mudie , Gary Mark Ignacio
- Applicant: Milind Raje , Robert Bennett , Andrew Mudie , Gary Mark Ignacio
- Applicant Address: AU Macquarie University, NSW
- Assignee: Cochlear Limited
- Current Assignee: Cochlear Limited
- Current Assignee Address: AU Macquarie University, NSW
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: B23K1/06
- IPC: B23K1/06 ; B23K26/00 ; H05K13/04 ; B23K20/00 ; A61N1/375 ; H05K3/34 ; H05K3/40 ; A61N1/36
Abstract:
Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.
Public/Granted literature
- US20140254124A1 Stud Bump Bonding in Implantable Medical Devices Public/Granted day:2014-09-11
Information query
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