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公开(公告)号：US09351436B2
公开(公告)日：2016-05-24
申请号：US13790141
申请日：2013-03-08
Applicant: Milind Raje , Robert Bennett , Andrew Mudie , Gary Mark Ignacio
Inventor： Milind Raje , Robert Bennett , Andrew Mudie , Gary Mark Ignacio
CPC classification number: H05K13/0465 , A61N1/36032 , A61N1/36036 , A61N1/3754 , B23K1/06 , B23K20/004 , B23K26/21 , H01L2224/78301 , H01L2924/0002 , H05K3/3478 , H05K3/4007 , H05K3/4015 , H05K2201/0379 , H05K2201/0979 , H05K2201/10318 , H05K2203/0285 , H05K2203/049 , H05K2203/107 , H01L2924/0001
Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.
Abstract translation: 这里呈现的是用于将细长导体（例如导线或针）电连接到接合焊盘的凸起焊接技术。 多个柱形凸起结合到接合焊盘的表面上，并且细长电导体位于多个柱形凸起附近。 细长导体结合到一个或多个螺柱凸块。
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公开(公告)号：US20130073002A1
公开(公告)日：2013-03-21
申请号：US13238532
申请日：2011-09-21
Applicant: Tony Mikael NYGARD , Kostas TSAMPAZIS , Gary Mark IGNACIO , Paul Carter
Inventor： Tony Mikael NYGARD , Kostas TSAMPAZIS , Gary Mark IGNACIO , Paul Carter
IPC: A61N1/378
CPC classification number: A61N1/378 , A61N1/36036
Abstract: Medical device implants for stimulating the nervous system of a recipient are disclosed. Embodiments include a cochlear implant with electrodes for delivering charge to the cochlea of the recipient and stimulation circuitry for delivering the charge to the electrodes. The medical devices include a transfer line which carries power and/or communication signals, the transfer line being in contact with tissue of the recipient when the medical device implant is implanted. A leakage capture conductor and/or sensing electrode is located or locatable proximate the insulated conductor.
Abstract translation: 公开了用于刺激受体的神经系统的医疗装置植入物。 实施例包括具有用于将电荷递送到受体的耳蜗的电极的耳蜗植入物和用于将电荷输送到电极的刺激电路。 医疗设备包括传送电力和/或通信信号的传输线，当植入医疗器械植入物时，传输线与接受者的组织接触。 泄漏捕获导体和/或感测电极在绝缘导体附近定位或定位。
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公开(公告)号：US20140254124A1
公开(公告)日：2014-09-11
申请号：US13790141
申请日：2013-03-08
Applicant: Milind Raje , Robert Bennett , Andrew Mudie , Gary Mark Ignacio
Inventor： Milind Raje , Robert Bennett , Andrew Mudie , Gary Mark Ignacio
CPC classification number: H05K13/0465 , A61N1/36032 , A61N1/36036 , A61N1/3754 , B23K1/06 , B23K20/004 , B23K26/21 , H01L2224/78301 , H01L2924/0002 , H05K3/3478 , H05K3/4007 , H05K3/4015 , H05K2201/0379 , H05K2201/0979 , H05K2201/10318 , H05K2203/0285 , H05K2203/049 , H05K2203/107 , H01L2924/0001
Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.
Abstract translation: 这里呈现的是用于将细长导体（例如导线或针）电连接到接合焊盘的凸起焊接技术。 多个柱形凸起结合到接合焊盘的表面上，并且细长电导体位于多个柱形凸起附近。 细长导体结合到一个或多个螺柱凸块。
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