Invention Grant
- Patent Title: Heat sink in the aperture of substrate
- Patent Title (中): 散热器在基板的孔径
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Application No.: US14744946Application Date: 2015-06-19
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Publication No.: US09362200B2Publication Date: 2016-06-07
- Inventor: Hirokazu Honda , Shinji Watanabe , Toshihiro Iwasaki , Kiminori Ishido , Koichiro Niwa , Takeshi Miyakoshi , Sumikazu Hosoyamada , Yoshikazu Kumagaya , Tomoshige Chikai , Shingo Nakamura , Shotaro Sakumoto , Hiroaki Matsubara
- Applicant: J-DEVICES CORPORATION
- Applicant Address: JP Oita
- Assignee: J-DEVICES CORPORATION
- Current Assignee: J-DEVICES CORPORATION
- Current Assignee Address: JP Oita
- Agency: Typha IP LLC
- Priority: JP2014-126480 20140619
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/00 ; H01L23/367 ; H01L23/31 ; H01L23/498 ; H01L23/538 ; H01L23/40 ; H01L23/13
Abstract:
A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.
Public/Granted literature
- US20150371934A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-12-24
Information query
IPC分类:
