公开(公告)号：US09362200B2

公开(公告)日：2016-06-07

申请号：US14744946

申请日：2015-06-19

Applicant: J-DEVICES CORPORATION

Inventor： Hirokazu Honda ,  Shinji Watanabe ,  Toshihiro Iwasaki ,  Kiminori Ishido ,  Koichiro Niwa ,  Takeshi Miyakoshi ,  Sumikazu Hosoyamada ,  Yoshikazu Kumagaya ,  Tomoshige Chikai ,  Shingo Nakamura ,  Shotaro Sakumoto ,  Hiroaki Matsubara

IPC: H01L23/12 ,  H01L21/00 ,  H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/40 ,  H01L23/13

CPC classification number: H01L23/3675 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2224/83

Abstract: A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.

Abstract translation: 一种半导体封装，包括布置有在后侧到达半导体器件的第一孔的支撑衬底，半导体器件通过粘合剂粘合到支撑衬底的表面，覆盖半导体器件的绝缘层和用于连接 半导体器件和通过绝缘层的外部端子。 粘合剂可以形成第一孔的一部分。 此外，可以在第一孔中布置散热部，并且可以在第一孔中填充金属材料。