Invention Grant
- Patent Title: High performance interconnect physical layer
- Patent Title (中): 高性能互连物理层
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Application No.: US13976971Application Date: 2013-03-15
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Publication No.: US09378171B2Publication Date: 2016-06-28
- Inventor: Venkatraman Iyer , Darren S. Jue , Rahul Shah , Arvind Kumar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- International Application: PCT/US2013/032708 WO 20130315
- International Announcement: WO2014/065879 WO 20140501
- Main IPC: G06F9/46
- IPC: G06F9/46 ; G06F13/40 ; G06F12/08 ; G06F13/42 ; G06F9/30 ; H04L12/933 ; H04L12/741 ; G06F9/44
Abstract:
A serial data link is to be adapted during initialization of the link. Adaptation of the link is to include receiving a pseudorandom binary sequence (PRBS) from a remote agent, analyzing the PRBS to identify characteristics of the data link, and generating metric data describing the characteristics.
Public/Granted literature
- US20140215437A1 HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER Public/Granted day:2014-07-31
Information query
