Invention Grant
- Patent Title: Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
- Patent Title (中): 直接液体接触微通道传热装置，半导体装置的温度控制方法及其形成方法
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Application No.: US14746764Application Date: 2015-06-22
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Publication No.: US09448278B2Publication Date: 2016-09-20
- Inventor: Christopher R. Schroeder , Christopher W. Ackerman , James C. Shipley , Tolga Acikalin , Ioan Sauciuc , Michael L. Rutigliano , James G. Maveety , Ashish Gupta
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes Davda & Victor LLP
- Agent Alan S. Raynes
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/26 ; G06F1/20 ; H01L23/473 ; H01L23/467 ; F28F3/12
Abstract:
An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
Public/Granted literature
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