公开(公告)号：US20240421062A1

公开(公告)日：2024-12-19

申请号：US18334188

申请日：2023-06-13

Applicant: Intel Corporation

Inventor： Tolga Acikalin ,  Shuhei Yamada ,  Telesphor Kamgaing ,  Tae Young Yang

IPC: H01L23/498 ,  H01L21/3205 ,  H01L23/00 ,  H01L23/15 ,  H01L23/49 ,  H01L23/538 ,  H01L23/544 ,  H01L25/065

Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.

公开(公告)号：US20240421465A1

公开(公告)日：2024-12-19

申请号：US18334201

申请日：2023-06-13

Applicant: Intel Corporation

Inventor： Tolga Acikalin ,  Tae Young Yang ,  Shuhei Yamada ,  Telesphor Kamgaing

IPC: H01Q1/22 ,  H01L23/15 ,  H01L23/538 ,  H01L25/065 ,  H01P3/08 ,  H01Q13/02

Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.

公开(公告)号：US20220399307A1

公开(公告)日：2022-12-15

申请号：US17344681

申请日：2021-06-10

Applicant: Intel Corporation

Inventor： Brandon C. Marin ,  Sai Vadlamani ,  Omkar Karhade ,  Tolga Acikalin

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/64

Abstract: An electronic substrate may be fabricated having a core comprising a laminate including a metal layer between a first insulator layer and a second insulator layer, a metal via through the core, and metallization features on a first side and a second side of the core, wherein first ones of the metallization features are embedded within dielectric material on the first side of the core, and wherein a sidewall of the dielectric material and of the first insulator layer defines a recess over an area of the metal layer. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.

公开(公告)号：US12009321B2

公开(公告)日：2024-06-11

申请号：US17131863

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Tae Young Yang ,  Tolga Acikalin ,  Johanny Escobar Pelaez ,  Kenneth P. Foust ,  Chia-Pin Chiu ,  Renzhi Liu ,  Cheng-Yuan Chin

IPC: H01L23/66 ,  H01L23/14 ,  H01L29/93 ,  H01Q1/22 ,  H01Q1/42 ,  H01Q15/00 ,  H01Q15/14

CPC classification number: H01L23/66 ,  H01L23/14 ,  H01L29/93 ,  H01Q1/2283 ,  H01Q1/422 ,  H01Q15/002 ,  H01Q15/0026 ,  H01Q15/147 ,  H01L2223/6627 ,  H01L2223/6677

Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.

公开(公告)号：US10670523B2

公开(公告)日：2020-06-02

申请号：US15132452

申请日：2016-04-19

Applicant: INTEL CORPORATION

Inventor： Tolga Acikalin ,  Shengbo Xu ,  Melissa A. Cowan

IPC: G01N21/53

Abstract: Techniques are disclosed for particulate matter (PM) measurement in a medium (such as air) using flat-top intensity laser sheet beam generation. The techniques for generating the laser sheet beam may include nonspecialized optical elements (e.g., aspherical, spherical, biconvex, and/or cylindrical lenses) that are cost-effective, reduce the overall footprint of the system, and also provide for relatively increased power efficiencies compared to conventional techniques. The PM measurement system may use the laser sheet beam generated in combination with a medium flow channel to pass the medium through the laser sheet beam, thereby causing particulates within the medium to scatter light, which can be detected using a light sensor (e.g., a photodetector). The scattered light signals can then be analyzed to match them with corresponding particulate sizes and the amount of signals per particulate size can also be determined to measure the size and count of particulates within the medium.

公开(公告)号：US20220415742A1

公开(公告)日：2022-12-29

申请号：US17356239

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Bijoyraj Sahu ,  Tolga Acikalin ,  Anand Haridass ,  Vikrant Thigle

IPC: H01L23/34 ,  H01L23/36 ,  H01L23/48

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate, and a die, electrically coupled to the package substrate, including a silicon substrate having a first surface and an opposing second surface; a device layer at the first surface of the silicon substrate; and a dielectric layer, having a heater trace, at the second surface of the silicon substrate.

公开(公告)号：US09927620B2

公开(公告)日：2018-03-27

申请号：US14859489

申请日：2015-09-21

Applicant: Intel Corporation

Inventor： Shengbo Xu ,  Tolga Acikalin

IPC: G02B3/06 ,  G02B27/09 ,  G02B19/00 ,  H01S5/00 ,  G02B3/04 ,  G01N15/02 ,  G01N15/00

CPC classification number: G02B27/0927 ,  G01N15/0211 ,  G01N2015/0046 ,  G02B3/04 ,  G02B3/06 ,  G02B19/0014 ,  G02B19/0052 ,  H01S5/005

Abstract: Systems and techniques are disclosed for flat-top intensity laser sheet beam generation. The system includes a source of light directed at a first optical component arranged to receive the light and generate spherical aberration (e.g., third order positive aberration) in the light rays. The spherical aberration results in positive aberrations in the light in a first plane and also results in the light being substantially collimated in a second plane perpendicular to the first plane. In some cases, the source of light is provided from a laser diode and the first optical component is one of an aspherical lens and a spherical lens. The system also includes a second optical component for focusing the light in the second plane. In some cases, the second optical component is a cylindrical lens.

公开(公告)号：US20170082861A1

公开(公告)日：2017-03-23

申请号：US14859489

申请日：2015-09-21

Applicant: Intel Corporation

Inventor： Shengbo Xu ,  Tolga Acikalin

IPC: G02B27/09 ,  G01N15/02 ,  G02B3/04 ,  G02B3/06 ,  G02B19/00 ,  H01S5/00

CPC classification number: G02B27/0927 ,  G01N15/0211 ,  G01N2015/0046 ,  G02B3/04 ,  G02B3/06 ,  G02B19/0014 ,  G02B19/0052 ,  H01S5/005

Abstract: Systems and techniques are disclosed for flat-top intensity laser sheet beam generation. The system includes a source of light directed at a first optical component arranged to receive the light and generate spherical aberration (e.g., third order positive aberration) in the light rays. The spherical aberration results in positive aberrations in the light in a first plane and also results in the light being substantially collimated in a second plane perpendicular to the first plane. In some cases, the source of light is provided from a laser diode and the first optical component is one of an aspherical lens and a spherical lens. The system also includes a second optical component for focusing the light in the second plane. In some cases, the second optical component is a cylindrical lens.

公开(公告)号：US20230411369A1

公开(公告)日：2023-12-21

申请号：US17841451

申请日：2022-06-15

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Kaveh Hosseini ,  Chia-Pin Chiu ,  Tim T. Hoang ,  Tolga Acikalin ,  Cooper S. Levy

IPC: H01L25/16 ,  G02B6/42 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/167 ,  G02B6/4274 ,  H01L23/5381 ,  H01L2224/16225 ,  H01L23/49811 ,  H01L24/16 ,  H01L23/5383

Abstract: In one embodiment, an integrated circuit package includes a package substrate with a cavity, an integrated circuit device, a bridge, a photonic integrated circuit (PIC), and an electronic integrated circuit (EIC). The integrated circuit device is electrically coupled to the package substrate. The bridge and the PIC are in the cavity of the package substrate, and the bridge is electrically coupled to the package substrate. The EIC is above, and electrically coupled to, the bridge and the PIC.

公开(公告)号：US20220416428A1

公开(公告)日：2022-12-29

申请号：US17357658

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Tae Young Yang ,  Shuhei Yamada ,  Tolga Acikalin ,  Johanny Escobar Pelaez ,  Kenneth Foust ,  Jason Mix ,  Renzhi Liu

IPC: H01Q9/04 ,  H01Q1/22

Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.