Invention Grant
US09449853B2 Method for manufacturing semiconductor device comprising electron trap layer
有权
用于制造包括电子陷阱层的半导体器件的方法
- Patent Title: Method for manufacturing semiconductor device comprising electron trap layer
- Patent Title (中): 用于制造包括电子陷阱层的半导体器件的方法
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Application No.: US14471766Application Date: 2014-08-28
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Publication No.: US09449853B2Publication Date: 2016-09-20
- Inventor: Yoshitaka Yamamoto , Tetsuhiro Tanaka , Takayuki Inoue , Hideomi Suzawa
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-182664 20130904
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/441 ; H01L21/473 ; H01L29/786 ; H01L29/51 ; H01L21/02 ; H01L29/66 ; H01L29/423 ; H01L21/28 ; H01L29/792 ; H01L21/311 ; H01L21/3213 ; H01L21/465 ; H01L29/49 ; H01L27/12 ; H01L21/316

Abstract:
A semiconductor device in which the threshold is adjusted is provided. In a transistor including a semiconductor, a source or drain electrode electrically connected to the semiconductor, a gate electrode, and an electron trap layer between the gate electrode and the semiconductor, the electron trap layer includes crystallized hafnium oxide. The crystallized hafnium oxide is deposited by a sputtering method using hafnium oxide as a target. When the substrate temperature is Tsub (° C.) and the proportion of oxygen in an atmosphere is P (%) in the sputtering method, P≧45−0.15×Tsub is satisfied. The crystallized hafnium oxide has excellent electron trapping properties. By the trap of an appropriate number of electrons, the threshold of the semiconductor device can be adjusted.
Public/Granted literature
- US20150060846A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2015-03-05
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