Invention Grant
US09456528B2 Connecting structure of cooling device, cooling device, and method for connecting cooling device
有权
冷却装置的连接结构，冷却装置以及连接冷却装置的方法
- Patent Title: Connecting structure of cooling device, cooling device, and method for connecting cooling device
- Patent Title (中): 冷却装置的连接结构，冷却装置以及连接冷却装置的方法
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Application No.: US14401282Application Date: 2013-05-10
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Publication No.: US09456528B2Publication Date: 2016-09-27
- Inventor: Arihiro Matsunaga , Minoru Yoshikawa , Hitoshi Sakamoto , Akira Shoujiguchi , Masaki Chiba , Kenichi Inaba
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: JP2012-112498 20120516
- International Application: PCT/JP2013/003001 WO 20130510
- International Announcement: WO2013/172004 WO 20131121
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B23P15/26 ; H01L23/427 ; F28D15/02 ; G06F1/20 ; H01L23/40
Abstract:
It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.
Public/Granted literature
- US09433129B2 Connecting structure of cooling device, cooling device, and method for connecting cooling device Public/Granted day:2016-08-30
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