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    State estimation apparatus, method, and program
    1.
    发明授权
    State estimation apparatus, method, and program 有权

    公开(公告)号：US11486915B2

    公开(公告)日：2022-11-01

    申请号：US16629650

    申请日：2018-07-17

    Applicant: NEC Corporation

    Inventor： Eisuke Saneyoshi ,  Shigeru Koumoto ,  Akira Shoujiguchi

    IPC: G01R19/25

    Abstract: A state estimation apparatus is configured to extract a time interval to be analyzed from a time series of a first signal based on a second signal acquired in conjunction with the first signal relating to the operation of the facility, and estimate a change in a state of the facility based on waveform data of the time interval of the first signal.

    CONNECTING STRUCTURE OF COOLING DEVICE, COOLING DEVICE, AND METHOD FOR CONNECTING COOLING DEVICE
    2.
    发明申请
    CONNECTING STRUCTURE OF COOLING DEVICE, COOLING DEVICE, AND METHOD FOR CONNECTING COOLING DEVICE 有权
    冷却装置，冷却装置的连接结构和连接冷却装置的方法

    公开(公告)号：US20150131229A1

    公开(公告)日：2015-05-14

    申请号：US14401282

    申请日：2013-05-10

    Applicant: NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20336 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/08 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/2039 ,  Y10T29/4913 ,  Y10T29/53174 ,  H01L2924/00

    Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

    Abstract translation: 由于与要冷却的加热元件的热​​阻增加，因此使用相变系统的冷却装置，寻求高的热输送性能，以获得足够的冷却性能是不可能的，因此，冷却装置的连接结构 本发明的示例性方面包括具有开口的连接板; 薄板的压板可弹性变形; 第一固定装置，用于将压板固定到连接板上，其中压板设置成覆盖构成冷却装置的热接收装置; 以及第二固定装置，用于将所述连接板固定到基板上，所述热接收装置抵靠安装在所述基板上并设置在所述开口中的加热元件。

    Phase-change cooling device and phase-change cooling method
    3.
    发明授权
    Phase-change cooling device and phase-change cooling method 有权

    公开(公告)号：US10813243B2

    公开(公告)日：2020-10-20

    申请号：US15506564

    申请日：2015-08-20

    Applicant: NEC Corporation

    Inventor： Akira Shoujiguchi ,  Minoru Yoshikawa ,  Masaki Chiba ,  Arihiro Matsunaga ,  Masanori Sato

    IPC: H05K7/20

    Abstract: It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrigerant liquid reservoir connected to the main-liquid-pipe and configured to store the refrigerant liquid, and a plurality of sub-liquid-pipes respectively connecting the refrigerant liquid reservoir to the plurality of heat receiving units.

    COOLING DEVICE AND ELECTRIC EQUIPMENT USING THE SAME
    5.
    发明申请
    COOLING DEVICE AND ELECTRIC EQUIPMENT USING THE SAME 审中-公开
    冷却装置和使用该装置的电气设备

    公开(公告)号：US20140326016A1

    公开(公告)日：2014-11-06

    申请号：US14370194

    申请日：2012-12-21

    Applicant: NEC Corporation

    Inventor： Akira Shoujiguchi ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  F25B39/00

    CPC classification number: H05K7/208 ,  F25B39/00 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809 ,  H01L2924/00

    Abstract: A cooling device of the present invention is a cooling device arranged in a chassis equipped with an upper surface, and comprises: a refrigerant; a vaporizer that includes an evaporative vessel having a side face of a curved surface shape, and performs heat-absorption by making the refrigerant change its phase from a liquid phase state to a vapor phase state; a condenser that performs heat-radiation by making the refrigerant change its phase from a vapor phase state to a liquid phase state; a pipe that connects the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind that flows between an area over the evaporative vessel and the upper surface.

    Abstract translation: 本发明的冷却装置是布置在具有上表面的底盘中的冷却装置，包括：制冷剂; 蒸发器，其包括具有弯曲表面形状的侧面的蒸发容器，并且通过使制冷剂将其相位从液相状态转变为气相状态来进行吸热; 通过使制冷剂将其相位从气相状态转变为液相状态而进行热辐射的冷凝器; 连接蒸发器和冷凝器的管道; 以及流路抑制装置，用于抑制在蒸发容器上方的区域和上表面之间流动的冷却风。

    Electronic device and cooling system
    6.
    发明授权
    Electronic device and cooling system 有权

    公开(公告)号：US09820407B2

    公开(公告)日：2017-11-14

    申请号：US14768917

    申请日：2014-02-19

    Applicant: NEC Corporation

    Inventor： Hitoshi Sakamoto ,  Minoru Yoshikawa ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20145 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/202 ,  H05K7/205

    Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

    Cooling apparatus and cooling system
    8.
    发明授权
    Cooling apparatus and cooling system 有权
    冷却装置和冷却系统

    公开(公告)号：US09459031B2

    公开(公告)日：2016-10-04

    申请号：US14378659

    申请日：2013-02-13

    Applicant: NEC Corporation

    Inventor： Kenichi Inaba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Arihiro Matsunaga

    IPC: F25B43/00 ,  G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04

    CPC classification number: F25B43/00 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20818

    Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

    Abstract translation: 一种冷却装置，其特征在于，包括N个（N为2以上的整数）制冷剂储存单元，其沿垂直方向配置，构成为储存制冷剂，冷凝单元设置在所述N个制冷剂储存单元的上方;蒸气管，其使流出的气相制冷剂循环 的N个制冷剂储存单元的冷凝装置，将从冷凝装置流出的液相制冷剂循环到最上层的制冷剂储存部的液体管，以及使从上部制冷剂储存部流出的液相制冷剂循环的分离配管 到下部制冷剂储存单元。 液相制冷剂经由入口流入各制冷剂储存单元，经由形成在入口下方的第一连接口从制冷剂储存单元流出。

    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    COOLING APPARATUS, HEAT RECEIVING SECTION AND BOILING SECTION USED THEREIN, AND METHOD OF MANUFACTURING THE SAME 有权
    冷却装置，加热部分及其使用的沸腾部分及其制造方法

    公开(公告)号：US20150241096A1

    公开(公告)日：2015-08-27

    申请号：US14427487

    申请日：2013-07-19

    Applicant: NEC Corporation

    Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

    IPC: F25B39/02 ,  B23P15/26

    CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

    Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

    Abstract translation: 为了即使在加热元件具有较低的发热量的情况下也能保持高的冷却能力，相变冷却装置中的受热部的沸腾部分包括梳状结构和设置在底部的多孔层 该梳形结构的一部分在梳形结构的翅片之间。 通过这样的沸腾部分，强制使液相制冷剂的液膜变薄。 因此，即使在气相制冷剂的温度与受热面的温度之间的差异较小的情况下，液相制冷剂也相位变化为气相制冷剂。

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