Invention Grant
US09462674B1 Circuits for and methods of providing a charge device model ground path using substrate taps in an integrated circuit device
有权
在集成电路器件中使用衬底抽头提供充电器件模型接地路径的电路和方法
- Patent Title: Circuits for and methods of providing a charge device model ground path using substrate taps in an integrated circuit device
- Patent Title (中): 在集成电路器件中使用衬底抽头提供充电器件模型接地路径的电路和方法
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Application No.: US14010059Application Date: 2013-08-26
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Publication No.: US09462674B1Publication Date: 2016-10-04
- Inventor: Mohammed Fakhruddin , James Karp , Kuok-Khian Lo
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent John J. King
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H03K19/003 ; H05K1/02 ; H05K3/10
Abstract:
A circuit for providing a ground path in an integrated circuit device is described. The circuit comprises a device region formed in a substrate; a substrate tap formed adjacent to the device region; and a conductive path coupled between the substrate tap and a ground metal layer by way of a plurality of metal layers and vias, wherein the conductive path is configured to meet a predetermined design requirement.
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