公开(公告)号：US09462674B1

公开(公告)日：2016-10-04

申请号：US14010059

申请日：2013-08-26

Applicant: Xilinx, Inc.

Inventor： Mohammed Fakhruddin ,  James Karp ,  Kuok-Khian Lo

IPC: G06F17/50 ,  H03K19/003 ,  H05K1/02 ,  H05K3/10

CPC classification number: G06F17/5045 ,  G06F17/5036 ,  G06F17/5054 ,  G06F17/5068 ,  G06F17/5072 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5286 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H03K19/003

Abstract: A circuit for providing a ground path in an integrated circuit device is described. The circuit comprises a device region formed in a substrate; a substrate tap formed adjacent to the device region; and a conductive path coupled between the substrate tap and a ground metal layer by way of a plurality of metal layers and vias, wherein the conductive path is configured to meet a predetermined design requirement.

Abstract translation: 描述了用于在集成电路器件中提供接地路径的电路。 电路包括形成在衬底中的器件区域; 形成在所述器件区域附近的衬底抽头; 以及通过多个金属层和通孔耦合在所述衬底抽头和接地金属层之间的导电路径，其中所述导电路径被配置为满足预定的设计要求。