Invention Grant
- Patent Title: Face-up substrate integration with solder ball connection in semiconductor package
- Patent Title (中): 半导体封装中与焊球连接的正面衬底集成
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Application No.: US14220913Application Date: 2014-03-20
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Publication No.: US09468098B2Publication Date: 2016-10-11
- Inventor: Daeik Daniel Kim , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun , Mario Francisco Velez , Robert Paul Mikulka
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H05K1/11 ; H05K1/03 ; H05K1/18 ; H05K3/30 ; H05K3/40 ; H01L23/48 ; H01L23/64 ; H05K1/02 ; H05K3/36 ; H05K1/14 ; H05K1/16 ; H05K3/34
Abstract:
Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first set of one or more package pads formed on a face of a glass substrate. The semiconductor package also includes a second or laminate substrate with a second set of one or more package pads formed on a face of the second or laminate substrate. Solder balls are dropped, configured to contact the first set of one or more package pads with the second set of one or more package pads, wherein the first substrate or the 2D POG structure is placed face-up on the face of the second or laminate substrate. A printed circuit board (PCB) can be coupled to a bottom side of the second or laminate substrate.
Public/Granted literature
- US20150271920A1 FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICONDUCTOR PACKAGE Public/Granted day:2015-09-24
Information query
IPC分类:
