Invention Grant
- Patent Title: Semiconductor chip arrangement
- Patent Title (中): 半导体芯片布置
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Application No.: US14987818Application Date: 2016-01-05
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Publication No.: US09496351B2Publication Date: 2016-11-15
- Inventor: Johannes Laven , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/32 ; H01L21/265 ; H01L21/322 ; H01L29/66 ; H01L29/78 ; H01L29/739 ; H01L23/26 ; H01L23/528 ; H01L23/532 ; H01L29/36 ; H01L29/45 ; H01L29/08 ; H01L29/861 ; H01L29/872
Abstract:
A method for processing a semiconductor carrier is provided, the method including: providing a semiconductor carrier including a doped substrate region and a device region disposed over a first side of the doped substrate region, the device region including at least part of one or more electrical devices; and implanting ions into the doped substrate region to form a gettering region in the doped substrate region of the semiconductor carrier.
Public/Granted literature
- US20160118466A1 SEMICONDUCTOR CHIP ARRANGEMENT Public/Granted day:2016-04-28
Information query
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