Invention Grant
- Patent Title: Substrate liquid processing apparatus
- Patent Title (中): 基板液体处理装置
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Application No.: US14882864Application Date: 2015-10-14
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Publication No.: US09508569B2Publication Date: 2016-11-29
- Inventor: Shigehisa Inoue , Jiro Higashijima , Masami Akimoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2014-214944 20141022
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/12 ; B08B3/04 ; B05B15/02 ; B08B3/02
Abstract:
Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm.
Public/Granted literature
- US20160118275A1 SUBSTRATE LIQUID PROCESSING APPARATUS Public/Granted day:2016-04-28
Information query
IPC分类:
