公开(公告)号：US20140373877A1

公开(公告)日：2014-12-25

申请号：US14297723

申请日：2014-06-06

Applicant: Tokyo Electron Limited

Inventor： Shigehisa Inoue ,  Daisuke Nakayama ,  Katsufumi Matsuki ,  Takuro Masuzumi ,  Yuki Yoshida ,  Meitoku Aibara ,  Hiromi Kiyose ,  Takashi Uno ,  Hirotaka Maruyama ,  Kazuya Koyama ,  Takashi Nakazawa

IPC: B08B3/02 ,  H01L21/67

CPC classification number: B08B3/02 ,  H01L21/67051

Abstract: Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential.

Abstract translation: 公开了一种液体处理装置和液体处理方法，其中基板由液滴形式的处理液体处理。 液体处理装置包括：第一处理液体喷射单元，被配置为将含有纯水的液滴形式的第一处理液喷射到基板的表面; 以及第二处理液体喷射单元，被配置为以液滴的形式将作为连续液体流的第二处理液体朝向由第一处理液体处理的基板的表面喷射。 第二处理液将基板表面上的ζ电位反转为负ζ电位。

公开(公告)号：US09508569B2

公开(公告)日：2016-11-29

申请号：US14882864

申请日：2015-10-14

Applicant: Tokyo Electron Limited

Inventor： Shigehisa Inoue ,  Jiro Higashijima ,  Masami Akimoto

IPC: H01L21/67 ,  B08B3/12 ,  B08B3/04 ,  B05B15/02 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B05B13/0228 ,  B05B15/50 ,  B05B15/55 ,  B05B15/70 ,  B08B3/02 ,  B08B3/04 ,  B08B3/12

Abstract: Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm.

Abstract translation: 公开了一种基板液体处理装置，其包括：被配置为保持基板的基板保持单元; 处理液喷嘴，被配置为向由所述基板保持单元保持的所述基板供给处理液; 喷嘴臂，其构造成保持所述处理液喷嘴; 以及配置成将喷嘴臂的整个表面浸入清洁液体中以清洁喷嘴臂的臂清洁罐。

公开(公告)号：US20160118275A1

公开(公告)日：2016-04-28

申请号：US14882864

申请日：2015-10-14

Applicant: Tokyo Electron Limited

Inventor： Shigehisa Inoue ,  Jiro Higashijima ,  Masami Akimoto

IPC: H01L21/67 ,  B08B3/12 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B05B13/0228 ,  B05B15/50 ,  B05B15/55 ,  B05B15/70 ,  B08B3/02 ,  B08B3/04 ,  B08B3/12

Abstract: Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm.

Abstract translation: 公开了一种基板液体处理装置，其包括：被配置为保持基板的基板保持单元; 处理液喷嘴，被配置为向由所述基板保持单元保持的所述基板供给处理液; 喷嘴臂，其构造成保持所述处理液喷嘴; 以及配置成将喷嘴臂的整个表面浸入清洁液体中以清洁喷嘴臂的臂清洁罐。

公开(公告)号：US09953852B2

公开(公告)日：2018-04-24

申请号：US14525541

申请日：2014-10-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Jiro Higashijima ,  Yuichi Douki ,  Masami Akimoto ,  Shigehisa Inoue

IPC: H01L21/67 ,  B08B1/04

CPC classification number: H01L21/6715 ,  B08B1/04 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S134/902

Abstract: A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit.