Invention Grant
- Patent Title: Substrate processing device and substrate processing method
- Patent Title (中): 基板加工装置及基板加工方法
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Application No.: US14212382Application Date: 2014-03-14
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Publication No.: US09553003B2Publication Date: 2017-01-24
- Inventor: Konosuke Hayashi , Masaaki Furuya , Takashi Ootagaki , Yuji Nagashima , Atsushi Kinase , Masahiro Abe
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-054574 20130318; JP2013-205080 20130930; JP2014-031405 20140221
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02
Abstract:
In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.
Public/Granted literature
- US20140261554A1 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD Public/Granted day:2014-09-18
Information query
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