Invention Grant
- Patent Title: Panel with releasable core
- Patent Title (中): 面板带可释放芯
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Application No.: US14227697Application Date: 2014-03-27
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Publication No.: US09554468B2Publication Date: 2017-01-24
- Inventor: Ching-Ping Janet Shen , Charan K. Gurumurthy , Dilan Seneviratne , Ravi Shankar , Liwen Jin , Deepak Arora
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30 ; H05K3/46 ; B32B3/26 ; B32B15/20 ; B32B37/12 ; B32B7/12 ; B32B15/08 ; B32B37/10 ; H05K3/28 ; H01L23/13 ; H01L23/538

Abstract:
Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.
Public/Granted literature
- US20150181713A1 PANEL WITH RELEASABLE CORE Public/Granted day:2015-06-25
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