公开(公告)号：US20160365325A1

公开(公告)日：2016-12-15

申请号：US15246382

申请日：2016-08-24

Applicant: INTEL CORPORATION

Inventor： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US09449936B2

公开(公告)日：2016-09-20

申请号：US14641056

申请日：2015-03-06

Applicant: INTEL CORPORATION

Inventor： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC: H01L23/48 ,  H01L23/00 ,  H05K3/24

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US20170202080A1

公开(公告)日：2017-07-13

申请号：US15413156

申请日：2017-01-23

Applicant: Intel Corporation

Inventor： Ching-Ping Janet Shen ,  Ravi Shankar ,  Yonggang Li ,  Dilan Seneviratne ,  Charan K. Gurumurthy

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/38 ,  H05K1/03 ,  H05K3/20 ,  H05K1/18 ,  H05K3/28 ,  B23K1/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/38 ,  B32B3/30 ,  H05K3/10

CPC classification number: H05K1/0271 ,  B23K1/0008 ,  B23K1/0016 ,  B23K2101/42 ,  B32B3/30 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/283 ,  B32B27/38 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2419/00 ,  B32B2457/08 ,  B32B2607/00 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K1/183 ,  H05K3/022 ,  H05K3/10 ,  H05K3/107 ,  H05K3/202 ,  H05K3/284 ,  H05K3/386 ,  H05K2201/09036 ,  Y10T29/49124 ,  Y10T428/24851

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.

公开(公告)号：US09554472B2

公开(公告)日：2017-01-24

申请号：US14227723

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Ching-Ping Janet Shen ,  Ravi Shankar ,  Yonggang Li ,  Dilan Seneviratne ,  Charan K. Gurumurthy

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/10 ,  H05K1/18 ,  B23K1/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/38 ,  H05K3/02 ,  H05K3/38 ,  H05K3/28

CPC classification number: H05K1/0271 ,  B23K1/0008 ,  B23K1/0016 ,  B23K2101/42 ,  B32B3/30 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/283 ,  B32B27/38 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2419/00 ,  B32B2457/08 ,  B32B2607/00 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K1/183 ,  H05K3/022 ,  H05K3/10 ,  H05K3/107 ,  H05K3/202 ,  H05K3/284 ,  H05K3/386 ,  H05K2201/09036 ,  Y10T29/49124 ,  Y10T428/24851

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.

Abstract translation: 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个实例，制造可释放的芯板的技术可以包括将内箔连接到基本上矩形的基部，使用结合材料来定位位于内箔上的外导电箔或者使用连接材料，内箔和外导电 在外导电箔和内箔的边缘附近箔。

公开(公告)号：US09966351B2

公开(公告)日：2018-05-08

申请号：US15246382

申请日：2016-08-24

Applicant: INTEL CORPORATION

Inventor： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC: H01L23/48 ,  H01L23/00 ,  H05K3/24

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US09554468B2

公开(公告)日：2017-01-24

申请号：US14227697

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Ching-Ping Janet Shen ,  Charan K. Gurumurthy ,  Dilan Seneviratne ,  Ravi Shankar ,  Liwen Jin ,  Deepak Arora

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  B32B3/26 ,  B32B15/20 ,  B32B37/12 ,  B32B7/12 ,  B32B15/08 ,  B32B37/10 ,  H05K3/28 ,  H01L23/13 ,  H01L23/538

CPC classification number: H05K1/183 ,  B32B3/263 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B37/10 ,  B32B37/1284 ,  B32B2307/202 ,  B32B2457/08 ,  H01L23/13 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/185 ,  H05K3/284 ,  Y10T428/24612 ,  Y10T428/2495 ,  Y10T428/31678 ,  H01L2924/00

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.

Abstract translation: 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个实例，制造可释放的芯板的技术可以包括将内箔连接到基底上，将粘合剂层定位在内箔上，使得内箔基本上与基底的周边齐平，将外导电 或者利用保护材料覆盖粘合层，内箔和外导电箔之间的界面。