Invention Grant
- Patent Title: Method and system for providing magnetic junctions including free layers that are cobalt-free
- Patent Title (中): 提供包括无钴的自由层的磁连接的方法和系统
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Application No.: US14977094Application Date: 2015-12-21
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Publication No.: US09559143B2Publication Date: 2017-01-31
- Inventor: Xueti Tang , Jang-Eun Lee , Gen Feng , Dustin William Erickson
- Applicant: Samsung Electronics Co., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Convergent Law Group LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L27/22 ; H01L43/02 ; H01L43/10 ; H01L43/12
Abstract:
A magnetic junction usable in a magnetic device and a method for providing the magnetic junction are described. The magnetic junction includes a free layer, a nonmagnetic spacer layer, and a reference layer. The free layer includes at least one of Fe and at least one Fe alloy. Furthermore, the free layer excludes Co. The nonmagnetic spacer layer adjoins the free layer. The nonmagnetic spacer layer residing between reference layer and the free layer. The magnetic junction is configured such that the free layer is switchable between a plurality of stable magnetic states when a write current is passed through the magnetic junction.
Public/Granted literature
- US20160197119A1 METHOD AND SYSTEM FOR PROVIDING MAGNETIC JUNCTIONS INCLUDING FREE LAYERS THAT ARE COBALT-FREE Public/Granted day:2016-07-07
Information query
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