Invention Grant
- Patent Title: Structure with emedded EFS3 and FinFET device
- Patent Title (中): 具有EFS3和FinFET器件的结构
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Application No.: US14749970Application Date: 2015-06-25
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Publication No.: US09570454B2Publication Date: 2017-02-14
- Inventor: Ming Chyi Liu , Chang-Ming Wu , Shih-Chang Liu , Yu-Hsing Chang , Yuan-Tai Tseng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/78 ; H01L29/423 ; H01L29/10

Abstract:
The present disclosure relates to an integrated chip having a FinFET device and an embedded flash memory device, and a method of formation. In some embodiments, the integrated chip has a logic region and a memory region that is laterally separated from the logic region. The logic region has a first plurality of fins of semiconductor material protruding outward from a semiconductor substrate. A gate electrode is arranged over the first plurality of fins of semiconductor material. The memory region has a second plurality of fins of semiconductor material extending outward from the semiconductor substrate. An embedded flash memory cell is arranged onto the second plurality of fins of semiconductor material. The resulting integrated chip structure provides for good performance since it contains both a FinFET device and an embedded flash memory device.
Public/Granted literature
- US20160379987A1 STRUCTURE WITH EMEDDED EFS3 AND FINFET DEVICE Public/Granted day:2016-12-29
Information query
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