Invention Grant
- Patent Title: Adhesive agent having a polyimide and acid modified rosin
- Patent Title (中): 具有聚酰亚胺和酸改性松香的粘合剂
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Application No.: US14647178Application Date: 2013-12-04
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Publication No.: US09591768B2Publication Date: 2017-03-07
- Inventor: Koichi Fujimaru , Toshihisa Nonaka
- Applicant: TORAY INDUSTRIES, INC.
- Applicant Address: JP Tokyo
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2012-283937 20121227
- International Application: PCT/JP2013/082559 WO 20131204
- International Announcement: WO2014/103637 WO 20140703
- Main IPC: H05K3/32
- IPC: H05K3/32 ; C09J163/00 ; C09J179/08 ; C09J193/04 ; H01L21/683 ; H05K3/30 ; H01L23/00 ; H05K3/34
Abstract:
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.
Public/Granted literature
- US20150315436A1 ADHESIVE AGENT, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-11-05
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