公开(公告)号：US20140291870A1

公开(公告)日：2014-10-02

申请号：US14354045

申请日：2012-10-24

Applicant: TORAY Industries, Inc.

Inventor： Yoichi Shimba ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC: H01L23/00 ,  C09J163/00

CPC classification number: H01L24/29 ,  C08G59/188 ,  C08G59/24 ,  C08K3/36 ,  C08K9/04 ,  C08K9/10 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29386 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/05442 ,  H01L2924/00

Abstract: A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a microcapsule type hardening acceleration agent, and (c) an inorganic particle whose surface is modified with a compound that has an unsaturated double bond.

Abstract translation: 通过含有（a）环氧化合物，（b）微胶囊型硬化促进剂的树脂组合物和（c）表面被改性的无机粒子的树脂组合物提供了保存稳定性和连接可靠性两者均优异的树脂组合物 具有不饱和双键的化合物。

公开(公告)号：US10294395B2

公开(公告)日：2019-05-21

申请号：US15533182

申请日：2015-12-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki Matsumura ,  Koichi Fujimaru ,  Daisuke Kanamori

IPC: C09J11/04 ,  C09J171/12 ,  C09J11/06 ,  C09J163/00 ,  C09J201/00 ,  C09J193/04 ,  H01L23/544 ,  H01L23/00

Abstract: The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

公开(公告)号：US09591768B2

公开(公告)日：2017-03-07

申请号：US14647178

申请日：2013-12-04

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koichi Fujimaru ,  Toshihisa Nonaka

IPC: H05K3/32 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  H01L21/683 ,  H05K3/30 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K3/323 ,  C08K3/013 ,  C08L63/00 ,  C08L79/08 ,  C08L93/04 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  C09J2479/083 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81907 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0154 ,  H05K2201/10977 ,  Y02P70/613 ,  C08K3/0033 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.

Abstract translation: 本发明涉及可用于将半导体芯片安装在电路板等上的粘合剂。 本发明解决了提供具有优异的储存稳定性和优异的连接可靠性的粘合剂的问题。 解决问题的手段是粘合剂，其包含（a）聚酰胺，（b）环氧化合物和（c）酸改性的松香。

公开(公告)号：US20170362472A1

公开(公告)日：2017-12-21

申请号：US15533182

申请日：2015-12-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki Matsumura ,  Koichi Fujimaru ,  Daisuke Kanamori

IPC: C09J11/04 ,  C09J171/12 ,  C09J11/06 ,  H01L23/544 ,  H01L23/00 ,  C09J163/00 ,  C09J193/04

CPC classification number: C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J171/12 ,  C09J193/04 ,  C09J201/00 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/16501 ,  H01L2224/8113 ,  H01L2224/81855 ,  H01L2924/3512 ,  C08K3/36 ,  C08L93/04

Abstract: The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average, particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

公开(公告)号：US20150072477A1

公开(公告)日：2015-03-12

申请号：US14389982

申请日：2013-05-21

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki Matsumura ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC: H01L23/00

CPC classification number: H01L24/29 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1053 ,  C08G73/106 ,  C08L63/00 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2431/006 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/11831 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/27831 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00

Abstract: An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.

Abstract translation: 用于生产具有凸起电极的半导体器件的粘合片，包括软膜和形成在软膜上的碱溶性粘合剂膜，能够暴露凸起电极而不会对突起电极造成损害，然后湿法蚀刻 使用碱性水溶液的凸块上的粘合剂使得可以进入在凸块顶部上不存在粘合剂的状态，从而能够制造在倒装芯片封装之后连接可靠性优异的半导体器件。