公开(公告)号：US20150050778A1

公开(公告)日：2015-02-19

申请号：US14383494

申请日：2013-02-20

Applicant: TORAY Industries, Inc.

Inventor： Noboru Asahi ,  Toshihisa Nonaka ,  Shoichi Niizeki

IPC: H01L23/00 ,  B32B37/00 ,  B32B38/00 ,  H01L25/065

CPC classification number: H01L24/83 ,  B32B37/0046 ,  B32B38/004 ,  B32B2307/202 ,  B32B2311/00 ,  B32B2457/14 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/753 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/81005 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2224/16145 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2924/014 ,  H01L2224/05552

Abstract: Disclosed is a method for producing a semiconductor device in which solder joints are made between a semiconductor chip with bumps and a substrate with electrodes corresponding to the bumps through a thermosetting adhesive layer, the method including the successive steps of: (A) forming a thermosetting adhesive layer in advance on a surface including bumps of the semiconductor chip; (B) laying a surface on the thermosetting adhesive layer side of the semiconductor chip, on which the thermosetting adhesive layer is formed, and a substrate one upon another, followed by pre-bonding using a heat tool to obtain a pre-bonded laminate; and (C) interposing a protective film having a thermal conductivity of 100 W/mK or more between the heat tool and a surface on the semiconductor chip side of the pre-bonded laminate, melting a solder between the semiconductor chips and the substrate and simultaneously curing the thermosetting adhesive layer using the heat tool. There is provided a method and an apparatus for producing a semiconductor device, which is capable of making a satisfactory joint without causing catching of a resin of an adhesive film between bumps and electrode pads.

Abstract translation: 公开了一种制造半导体器件的方法，其中在具有凸块的半导体芯片和具有通过热固性粘合剂层对应于凸块的电极的基板之间形成焊点，该方法包括以下连续步骤：（A）形成热固性 粘合剂层预先在包含半导体芯片的凸块的表面上; （B）在其上形成有热固性粘合剂层的半导体芯片的热固性粘合层一侧和另一个基板上放置表面，然后使用热工具进行预接合以获得预结合的层压体; 和（C）在热工具与预接合层叠体的半导体芯片侧的表面之间插入热导率为100W / mK以上的保护膜，使半导体芯片和基板之间的焊料熔融 使用热工具固化热固性粘合剂层。 提供了一种用于制造半导体器件的方法和装置，其能够在不引起突起和电极焊盘之间的粘合剂膜的树脂的捕获的情况下形成令人满意的接合。

公开(公告)号：US09738763B2

公开(公告)日：2017-08-22

申请号：US14783641

申请日：2014-05-30

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yoichi Shimba ,  Kazuyuki Matsumura ,  Toshihisa Nonaka

IPC: C08J5/18 ,  C08K5/07 ,  B29C41/02 ,  C08K9/04 ,  H01L21/50 ,  H01L23/00 ,  H01L21/683 ,  C08K3/00 ,  H05K3/30 ,  H01L23/495 ,  B29K63/00 ,  B29K105/16 ,  B29K509/00 ,  H01L21/603

CPC classification number: C08J5/18 ,  B29C41/02 ,  B29K2063/00 ,  B29K2105/16 ,  B29K2509/00 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/07 ,  C08K9/04 ,  H01L21/50 ,  H01L21/6836 ,  H01L23/49558 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2021/603 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3512 ,  H05K3/305 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  C08K3/0033 ,  C08L63/00

Abstract: Provided is a resin sheet, wherein in a stress measurement in which a dynamic shear strain is applied in a direction parallel to a surface, the difference between a loss tangent as measured when a strain amplitude is 10% of the sheet thickness and a loss tangent as measured when the amplitude is 0.1% is equal to or greater than 1 at a temperature of 80° C. and a frequency of 0.5 Hz. The resin sheet of the present invention can provide a semiconductor device with excellent connection reliability, wherein air bubbles and cracks are less likely to occur in the resin sheet. In the resin composition of the present invention, aggregates are less likely to occur during storage. The resin sheet obtained by forming the resin composition into a sheet has good flatness. The hardened material thereof can provide a circuit board or a semiconductor device with high connection reliability.

公开(公告)号：US09617451B2

公开(公告)日：2017-04-11

申请号：US15111265

申请日：2015-01-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takuro Oda ,  Daisuke Kanamori ,  Toshihisa Nonaka

IPC: C09J9/02 ,  C09D163/00 ,  C09J7/02 ,  C09J179/08 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  C08G73/10 ,  C09J163/00 ,  C08K3/00 ,  H01L23/29 ,  H05K3/32

CPC classification number: C09J9/02 ,  C08G73/106 ,  C08G2170/00 ,  C09D163/00 ,  C09J7/20 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/00 ,  C09J2479/08 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H05K3/321 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  C08L1/00 ,  H01L2924/07025 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/05042 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/0498 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/0544 ,  H01L2924/01006

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

公开(公告)号：US20140291870A1

公开(公告)日：2014-10-02

申请号：US14354045

申请日：2012-10-24

Applicant: TORAY Industries, Inc.

Inventor： Yoichi Shimba ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC: H01L23/00 ,  C09J163/00

CPC classification number: H01L24/29 ,  C08G59/188 ,  C08G59/24 ,  C08K3/36 ,  C08K9/04 ,  C08K9/10 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29386 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/05442 ,  H01L2924/00

Abstract: A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a microcapsule type hardening acceleration agent, and (c) an inorganic particle whose surface is modified with a compound that has an unsaturated double bond.

Abstract translation: 通过含有（a）环氧化合物，（b）微胶囊型硬化促进剂的树脂组合物和（c）表面被改性的无机粒子的树脂组合物提供了保存稳定性和连接可靠性两者均优异的树脂组合物 具有不饱和双键的化合物。

公开(公告)号：US09591768B2

公开(公告)日：2017-03-07

申请号：US14647178

申请日：2013-12-04

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koichi Fujimaru ,  Toshihisa Nonaka

IPC: H05K3/32 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  H01L21/683 ,  H05K3/30 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K3/323 ,  C08K3/013 ,  C08L63/00 ,  C08L79/08 ,  C08L93/04 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  C09J2479/083 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81907 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0154 ,  H05K2201/10977 ,  Y02P70/613 ,  C08K3/0033 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.

Abstract translation: 本发明涉及可用于将半导体芯片安装在电路板等上的粘合剂。 本发明解决了提供具有优异的储存稳定性和优异的连接可靠性的粘合剂的问题。 解决问题的手段是粘合剂，其包含（a）聚酰胺，（b）环氧化合物和（c）酸改性的松香。

公开(公告)号：US20150072477A1

公开(公告)日：2015-03-12

申请号：US14389982

申请日：2013-05-21

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki Matsumura ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC: H01L23/00

CPC classification number: H01L24/29 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1053 ,  C08G73/106 ,  C08L63/00 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2431/006 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/11831 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/27831 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00

Abstract: An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.

Abstract translation: 用于生产具有凸起电极的半导体器件的粘合片，包括软膜和形成在软膜上的碱溶性粘合剂膜，能够暴露凸起电极而不会对突起电极造成损害，然后湿法蚀刻 使用碱性水溶液的凸块上的粘合剂使得可以进入在凸块顶部上不存在粘合剂的状态，从而能够制造在倒装芯片封装之后连接可靠性优异的半导体器件。

公开(公告)号：US10050005B2

公开(公告)日：2018-08-14

申请号：US15038266

申请日：2014-11-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daisuke Kanamori ,  Takuro Oda ,  Toshihisa Nonaka

IPC: C09J163/00 ,  H01L23/00 ,  C08L21/00 ,  H01L21/683 ,  C09D179/08 ,  C08G73/10 ,  C09J179/08 ,  C09J9/02 ,  C09J7/20 ,  C08K3/36 ,  C08L63/00

Abstract: The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.