Invention Grant
- Patent Title: Substrate holder, polishing apparatus, and polishing method
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Application No.: US13752659Application Date: 2013-01-29
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Publication No.: US09662764B2Publication Date: 2017-05-30
- Inventor: Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2012-018538 20120131; JP2012-076677 20120329
- Main IPC: B24B37/04
- IPC: B24B37/04 ; B24B37/32 ; B24B37/30

Abstract:
The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.
Public/Granted literature
- US20130196573A1 SUBSTRATE HOLDER, POLISHING APPARATUS, AND POLISHING METHOD Public/Granted day:2013-08-01
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