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1.发明申请公开(公告)号：US20200047308A1
公开(公告)日：2020-02-13
申请号：US16655639
申请日：2019-10-17
申请人： Ebara Corporation
发明人： Shingo Togashi , Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya
摘要： Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.
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公开(公告)号：US10414015B2
公开(公告)日：2019-09-17
申请号：US15248112
申请日：2016-08-26
申请人： Ebara Corporation
发明人： Makoto Fukushima , Hozumi Yasuda , Shingo Togashi
IPC分类号： B24B37/005
摘要： A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.
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公开(公告)号：US10213896B2
公开(公告)日：2019-02-26
申请号：US15402703
申请日：2017-01-10
申请人： EBARA CORPORATION
发明人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki , Shintaro Isono
IPC分类号： B24B37/30
摘要： An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
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公开(公告)号：US09815171B2
公开(公告)日：2017-11-14
申请号：US14537809
申请日：2014-11-10
申请人： EBARA CORPORATION
发明人： Satoru Yamaki , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Makoto Fukushima , Shingo Togashi
CPC分类号： B24B37/32 , B24B37/04 , B24B37/107
摘要： A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.
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公开(公告)号：US09676076B2
公开(公告)日：2017-06-13
申请号：US13916432
申请日：2013-06-12
申请人： EBARA CORPORATION
发明人： Keisuke Namiki , Hozumi Yasuda , Shingo Togashi
IPC分类号： B24B37/013
CPC分类号： B24B37/013
摘要： A polishing method is used for polishing a film formed on a substrate by pressing the substrate against a polishing pad. The polishing method includes preparing, in advance, an algorithm for correction of polishing time from a relationship between a known amount of wear of the polishing pad or a known thickness of the polishing pad, and a polishing time and a polishing amount; setting a polishing target value for the film; and measuring an amount of wear of the polishing pad or a thickness of the polishing pad. The polishing method further includes determining an optimal polishing time for the polishing target value from the measured amount of wear of the polishing pad or the measured thickness of the polishing pad and from the algorithm; and polishing the film for the determined optimal polishing time.
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8.发明申请公开(公告)号：US20170106497A1
公开(公告)日：2017-04-20
申请号：US15292325
申请日：2016-10-13
申请人： Ebara Corporation
发明人： Shingo Togashi , Hozumi Yasuda , Makoto Fukushima , Osamu Nabeya
摘要： Provided is a substrate holding device used in a substrate polishing apparatus that polishes a substrate using a polishing pad. The substrate holding device includes: a retainer ring configured to hold a peripheral edge of the substrate; and a drive ring fixed to the retainer ring so as to rotate together with the retainer ring. The surface of the retainer ring at the polishing pad side has a convex portion at a position other than an innermost circumference following a shape of the drive ring.
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公开(公告)号：US08859070B2
公开(公告)日：2014-10-14
申请号：US13687263
申请日：2012-11-28
申请人： Ebara Corporation
发明人： Hozumi Yasuda , Katsuhide Watanabe , Keisuke Namiki , Osamu Nabeya , Makoto Fukushima , Satoru Yamaki , Shingo Togashi
CPC分类号： B32B3/08 , B24B37/30 , B32B3/18 , B32B27/12 , Y10T428/21 , Y10T428/24174 , Y10T428/24851
摘要： An elastic member for use in a substrate holding apparatus includes an elastic member and a first reinforcing member. The first reinforcing member has a higher rigidity than the elastic membrane and reinforces substantially an entire area of the contact portion of the elastic membrane. The contact portion of the elastic member has a contact portion for contact with the substrate. The first peripheral wall portion of the elastic membrane is coupled to a peripheral end of the contact portion and extends upwardly. The second peripheral wall portion of the elastic member defines a first chamber on an outer side thereof and a second chamber on an inner side thereof. The first reinforcing member is embedded in substantially the entire area of the contact portion of the elastic membrane.
摘要翻译： 用于基板保持装置的弹性构件包括弹性构件和第一加强构件。 第一加强构件具有比弹性膜更高的刚性，并且基本上加强弹性膜的接触部分的整个区域。 弹性构件的接触部分具有用于与衬底接触的接触部分。 弹性膜的第一周壁连接到接触部分的外周端并向上延伸。 弹性构件的第二周壁部分在其外侧上限定第一室，在其内侧限定第二室。 第一加强构件嵌入在弹性膜的接触部分的大致整个区域中。
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公开(公告)号：US20220168864A1
公开(公告)日：2022-06-02
申请号：US17419029
申请日：2019-10-16
申请人： EBARA CORPORATION
IPC分类号： B24B37/005 , G06N20/20 , G06K9/62
摘要： An information processing apparatus is an information processing apparatus that determines a polishing recipe based on area response data acquired by changing a pressure for each area in a polishing head, the apparatus including an irregularity-presence-or-absence estimation unit that estimates and outputs whether an irregularity is present using new area response data as an input, a screening unit estimates and outputs, when the irregularity-presence-or-absence estimation unit estimates that an irregularity is present, area response data after the removal of the irregularity using area response data estimated that an irregularity is present as an input, and a simulation unit that determines a polishing recipe by simulation based on area response data estimated by the irregularity-presence-or-absence estimation unit that no irregularity is present or a response for each area after the removal of the irregularity estimated by the screening unit.
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