公开(公告)号：US11745306B2

公开(公告)日：2023-09-05

申请号：US16724504

申请日：2019-12-23

Applicant: Ebara Corporation

Inventor： Tomoko Owada ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Yoshikazu Kato

IPC: B24B49/04 ,  B24B41/047

CPC classification number: B24B49/045 ,  B24B41/047

Abstract: A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.

公开(公告)号：US20210335650A1

公开(公告)日：2021-10-28

申请号：US17371518

申请日：2021-07-09

Applicant: EBARA CORPORATION

Inventor： Satoru Yamaki ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Tomoko Owada ,  Yoshikazu Kato

IPC: H01L21/687 ,  B24B37/30 ,  B24B37/10 ,  B24B7/04

Abstract: An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

公开(公告)号：US20200206868A1

公开(公告)日：2020-07-02

申请号：US16724504

申请日：2019-12-23

Applicant: Ebara Corporation

Inventor： Tomoko Owada ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Yoshikazu Kato

IPC: B24B49/04 ,  B24B41/047

Abstract: A polishing apparatus includes a rotatable head body having a pressing surface, a retainer ring configured to press a polishing surface while rotating together with the head body, a stationary ring, local load applying devices configured to apply a local load to the stationary ring, and a controller. The local load applying devices include a first pressing member and a second pressing member connected to the stationary ring. The first pressing member is disposed in the upstream side of the retainer ring in the traveling direction of the polishing surface, and the second pressing member is disposed in the downstream side. The controller calculates the inclination angle of the stationary ring based on a measured value of the height of at least one of the first pressing member and the second pressing member.

公开(公告)号：USD813180S1

公开(公告)日：2018-03-20

申请号：US29580339

申请日：2016-10-07

Applicant: EBARA CORPORATION

Designer： Makoto Fukushima ,  Hozumi Yasuda ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki

公开(公告)号：USD794585S1

公开(公告)日：2017-08-15

申请号：US29560291

申请日：2016-04-05

Applicant: EBARA CORPORATION

Designer： Osamu Nabeya ,  Hozumi Yasuda ,  Makoto Fukushima ,  Keisuke Namiki ,  Shingo Togashi ,  Satoru Yamaki

公开(公告)号：USD770990S1

公开(公告)日：2016-11-08

申请号：US29489477

申请日：2014-04-30

Applicant: EBARA CORPORATION

Designer： Makoto Fukushima ,  Hozumi Yasuda ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki

公开(公告)号：US11958163B2

公开(公告)日：2024-04-16

申请号：US17511340

申请日：2021-10-26

Applicant: EBARA CORPORATION

Inventor： Osamu Nabeya ,  Makoto Fukushima ,  Keisuke Namiki ,  Shingo Togashi ,  Satoru Yamaki ,  Masahiko Kishimoto ,  Tomoko Owada

IPC: B24B37/30 ,  B24B37/04 ,  B24B37/32 ,  H01L21/304 ,  H01L21/687

CPC classification number: B24B37/30 ,  B24B37/04 ,  B24B37/32 ,  H01L21/304 ,  H01L21/68721

Abstract: A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.

公开(公告)号：USD1021832S1

公开(公告)日：2024-04-09

申请号：US29874375

申请日：2023-04-19

Applicant: EBARA CORPORATION

Designer： Kenichi Akazawa ,  Osamu Nabeya ,  Shingo Togashi ,  Satoru Yamaki ,  Tomoko Owada ,  Cheng Cheng ,  Yuichi Kato

Abstract: FIG. 1 is a top perspective view of an elastic membrane showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front view thereof, a rear view being identical thereto;
FIG. 6 is a right-side view thereof, a left-side view being identical thereto;
FIG. 7 is a cross sectional view taken along section line 7-7 in FIG. 3; and,
FIG. 8 is an enlarged portion view taken along line 8-8 in FIG. 7.
The broken lines in the drawings depict portions of the elastic membrane that form no part of the claimed design.

公开(公告)号：US20200043773A1

公开(公告)日：2020-02-06

申请号：US16532843

申请日：2019-08-06

Applicant: EBARA CORPORATION

Inventor： Osamu Nabeya ,  Satoru Yamaki ,  Makoto Fukushima

IPC: H01L21/683 ,  H01L21/67 ,  B24B37/30 ,  H01L21/02 ,  H01L21/304

Abstract: A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.

公开(公告)号：USD859332S1

公开(公告)日：2019-09-10

申请号：US29630484

申请日：2017-12-21

Applicant: EBARA CORPORATION

Designer： Satoru Yamaki ,  Makoto Fukushima ,  Keisuke Namiki ,  Osamu Nabeya ,  Shingo Togashi ,  Tomoko Owada