Invention Grant
- Patent Title: High voltage field effect transistors
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Application No.: US14946718Application Date: 2015-11-19
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Publication No.: US09685508B2Publication Date: 2017-06-20
- Inventor: Han Wui Then , Robert Chau , Benjamin Chu-Kung , Gilbert Dewey , Jack Kavalieros , Matthew Metz , Niloy Mukherjee , Ravi Pillarisetty , Marko Radosavljevic
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/775 ; G05F3/02 ; H01L29/786 ; B82Y10/00 ; H01L21/02 ; H01L21/225 ; H01L21/283 ; H01L21/306 ; H01L21/31 ; H01L21/311 ; H01L21/3213 ; H01L21/324 ; H01L29/04 ; H01L29/417 ; H01L29/423 ; H01L29/20

Abstract:
Transistors suitable for high voltage and high frequency operation are disclosed. A nanowire is disposed vertically or horizontally on a substrate. A longitudinal length of the nanowire is defined into a channel region of a first semiconductor material, a source region electrically coupled with a first end of the channel region, a drain region electrically coupled with a second end of the channel region, and an extrinsic drain region disposed between the channel region and drain region. The extrinsic drain region has a wider bandgap than that of the first semiconductor. A gate stack including a gate conductor and a gate insulator coaxially wraps completely around the channel region, drain and source contacts similarly coaxially wrap completely around the drain and source regions.
Public/Granted literature
- US20160079359A1 HIGH VOLTAGE FIELD EFFECT TRANSISTORS Public/Granted day:2016-03-17
Information query
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