Invention Grant
- Patent Title: Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
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Application No.: US15005220Application Date: 2016-01-25
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Publication No.: US09691696B2Publication Date: 2017-06-27
- Inventor: Hong Shen , Liang Wang , Rajesh Katkar
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L21/288 ; H01L21/768 ; H01L25/065 ; H01L25/00 ; H01L23/04 ; H01L23/14 ; H01L23/367 ; H01L23/00 ; H01L23/48 ; H01L23/538 ; H01L23/10
Abstract:
Stacked dies (110) are encapsulated in an interposer's cavity (304) by multiple encapsulant layers (524) formed of moldable material. Conductive paths (520, 620.3) connect the dies to the cavity's bottom wall (304B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole (514) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.
Public/Granted literature
Information query
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