Invention Grant
- Patent Title: Adhesive for floor structure
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Application No.: US14435892Application Date: 2013-09-26
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Publication No.: US09695346B2Publication Date: 2017-07-04
- Inventor: Yukihiko Murayama
- Applicant: Sekisui Fuller Company, Ltd.
- Applicant Address: JP Tokyo
- Assignee: SEKISUI FULLER COMPANY, LTD.
- Current Assignee: SEKISUI FULLER COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2012-233131 20121022; JP2013-010364 20130123
- International Application: PCT/JP2013/076125 WO 20130926
- International Announcement: WO2014/065076 WO 20140501
- Main IPC: C08K7/28
- IPC: C08K7/28 ; C09J171/02 ; C09J9/00 ; C09J11/04 ; C08G65/336 ; C09J163/00 ; C08K3/26 ; C08K7/26 ; C08K7/00 ; E04F15/18

Abstract:
The present invention provides an adhesive for floor structure that can provide a floor structure inhibiting floor squeaks or joint gaps from occurring and that enables a floor finishing material to be peeled easily from a sub-floor material when repairing the floor finishing material.The adhesive for floor structure of the present invention contains a hydrolyzable silyl group-containing polyoxypropylene-based polymer (I), calcium carbonate, and a hollow filler. The adhesive for floor structure of the present invention can be used for adhesively integrating a floor finishing material 20 with a sub-floor material 30 laid on a floor base 1.
Public/Granted literature
- US20150337184A1 ADHESIVE FOR FLOOR STRUCTURE Public/Granted day:2015-11-26
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