Invention Grant
- Patent Title: Method of forming fine pattern and method of manufacturing integrated circuit device using the method
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Application No.: US14958072Application Date: 2015-12-03
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Publication No.: US09704722B2Publication Date: 2017-07-11
- Inventor: Jeong-ju Park , Seung-chul Kwon , Eun-sung Kim , Jae-woo Nam , Shi-yong Yi , Hyun-woo Kim
- Applicant: Jeong-ju Park , Seung-chul Kwon , Eun-sung Kim , Jae-woo Nam , Shi-yong Yi , Hyun-woo Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0180500 20141215
- Main IPC: G03F7/40
- IPC: G03F7/40 ; H01L21/311 ; G03F7/00 ; C08L53/00 ; B82Y10/00 ; G03F7/16 ; G03F7/20 ; B82Y40/00 ; H01L21/02 ; H01L21/027 ; H01L21/3065 ; H01L21/033 ; H01L21/308 ; H01L21/3213 ; H01L27/108

Abstract:
A method of forming a fine pattern includes forming pillar-shaped guides regularly arranged on a feature layer, forming a block copolymer layer on the feature layer around the pillar-shaped guides, phase separating the block copolymer layer, forming first domains regularly arranged on the feature layer with the pillar-shaped guides, forming a second domain on the feature layer surrounding the pillar-shaped guides and the first domains, removing the first domains, and forming holes corresponding with the first domains in the feature layer by etching the feature layer using the pillar-shaped guides and the second domain as etch masks. The block copolymer layer includes a polymer blend having first and second polymer blocks having first and second repeat units, respectively, a first homopolymer and a second homopolymer. The first domains include the first polymer block and the first homopolymer, and the second domain includes the second polymer block and the second homopolymer.
Public/Granted literature
- US20160172187A1 METHOD OF FORMING FINE PATTERN AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE METHOD Public/Granted day:2016-06-16
Information query
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