Invention Grant
- Patent Title: Interconnect alloy material and methods
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Application No.: US13801803Application Date: 2013-03-13
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Publication No.: US09731369B2Publication Date: 2017-08-15
- Inventor: Ting Zhong , Rajashree Raji Baskaran , Aleksandar Aleks Aleksov
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: B23K35/00
- IPC: B23K35/00 ; B23K35/22 ; B23K1/20 ; B23K35/02 ; B23K1/00 ; B23K3/06 ; B23K3/08 ; B23K35/24 ; B23K35/26 ; B23K35/30 ; B23K101/42
Abstract:
A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
Public/Granted literature
- US20140263588A1 INTERCONNECT ALLOY MATERIAL AND METHODS Public/Granted day:2014-09-18
Information query
