- 专利标题： Liquid sealing material and electronic component using same
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申请号： US15190765申请日： 2016-06-23
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公开(公告)号： US09748158B2公开(公告)日： 2017-08-29
- 发明人: Seiichi Ishikawa , Haruyuki Yoshii , Kazuyuki Kohara
- 申请人： NAMICS Corporation
- 申请人地址： JP Nigata
- 专利权人： NAMICS CORPORATION
- 当前专利权人： NAMICS CORPORATION
- 当前专利权人地址： JP Nigata
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 优先权： JP2012-161596 20120720
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; C08L63/00 ; C09J163/00 ; C08K3/36 ; C08K9/06 ; C08K5/5419 ; C08G59/24 ; C08G59/50 ; C09J11/04 ; C09J11/06 ; C08K5/09 ; C08K5/18
摘要：
A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.