公开(公告)号：US20240145113A1

公开(公告)日：2024-05-02

申请号：US18272229

申请日：2022-01-07

申请人： NAMICS CORPORATION

发明人： Toshiaki OGIWARA ,  Taku FUJINO

IPC分类号： H01B1/22 ,  H05K1/09 ,  H05K1/18

CPC分类号： H01B1/22 ,  H05K1/095 ,  H05K1/189

摘要： A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.

公开(公告)号：US20240047406A1

公开(公告)日：2024-02-08

申请号：US18017969

申请日：2021-06-02

申请人： NAMICS CORPORATION

发明人： Koji SASAKI

IPC分类号： H01L23/00 ,  B22F1/10 ,  B22F1/054 ,  B23K35/02 ,  B23K35/30

CPC分类号： H01L24/29 ,  B22F1/10 ,  B22F1/054 ,  B23K35/025 ,  B23K35/3006 ,  H01L2224/29339 ,  H01L2224/2929 ,  B22F2301/255 ,  B22F2304/05

摘要： Provided is a conductive composition capable of achieving excellent die shear strength by sintering silver particles together even by heat treatment at a low temperature or for a short period of time regardless of whether pressure is applied or not. The conductive composition contains silver particles (A) having an average particle size of 0.05 to 5 μm, a solvent (B), and a thermosetting resin (C). Easily saponifiable chlorine concentration of the thermosetting resin (C) is 3,000 to 12,000 ppm. The conductive composition contains 0.1 to 1.5 parts by mass of the thermosetting resin (C) based on 100 parts by mass of the silver particles (A).

公开(公告)号：US20230399550A1

公开(公告)日：2023-12-14

申请号：US18033660

申请日：2021-10-25

申请人： NAMICS CORPORATION

发明人： Ayako SATO

IPC分类号： C09J11/06 ,  C09J133/10 ,  C08K5/07 ,  C08F220/18

CPC分类号： C09J11/06 ,  C09J133/10 ,  C08K5/07 ,  C08F220/1818 ,  C08F220/1812 ,  H01L27/14618

摘要： A base-releasing composition which suppresses release of a basic compound at room temperature and rapidly releases the basic compound under predetermined conditions. The base-releasing composition includes (A) a side-chain crystalline (meth)acrylate copolymer includes (i) repeating units each derived from an ester of a C8-C32 saturated, linear primary alcohol with acrylic acid or methacrylic acid and (ii) repeating units each derived from acrylic acid or methacrylic acid, and (B) a basic compound. The amount of basic groups in the (B) basic compound is 0.01 to 1.00 mmol per 1 g of the base-releasing composition, and at least a portion of the Component (B) is included in the Component (A). A curable resin composition includes a specific 2-methylene-1,3-dicarbonyl compound in combination with the base-releasing composition.

公开(公告)号：US11817398B2

公开(公告)日：2023-11-14

申请号：US17280256

申请日：2019-09-24

申请人： NAMICS CORPORATION

发明人： Masashi Kajita ,  Masahiro Kitamura ,  Takayuki Higuchi ,  Noritsuka Mizumura

IPC分类号： H01L23/00 ,  B22F1/107 ,  B22F1/054 ,  B22F1/052

CPC分类号： H01L23/562 ,  B22F1/052 ,  B22F1/054 ,  B22F1/056 ,  B22F1/107 ,  H01L24/29 ,  H01L2224/29247 ,  H01L2924/15747 ,  H01L2924/3512 ,  B22F2999/00 ,  B22F1/05 ,  B22F2304/058 ,  C22C1/0425 ,  B22F2999/00 ,  B22F2304/056 ,  B22F1/054 ,  B22F1/056 ,  B22F2304/056 ,  B22F2304/054 ,  C22C1/0425

摘要： A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.

公开(公告)号：US20230299461A1

公开(公告)日：2023-09-21

申请号：US18010265

申请日：2021-06-17

申请人： NAMICS CORPORATION

发明人： Hiroshi Takasugi ,  Ryo Usami ,  Fumikazu Komatsu ,  Shin Teraki

IPC分类号： H01Q1/22 ,  H01B3/44 ,  H01L23/66

CPC分类号： H01Q1/2283 ,  H01B3/442 ,  H01L23/66 ,  H01L2223/6677

摘要： Provided is an antenna-equipped semiconductor package which is excellent in solder heat resistance and has low transmission loss. In the antenna-equipped semiconductor package 100 in which an antenna unit 5 is integrally formed in a semiconductor device unit 10, at least one of an insulating layer 1 for connecting the semiconductor device unit 10 and the antenna unit 5 and an insulating layer 1 inside the antenna unit is a cured product of a resin composition including (A) a styrene-based elastomer having a double bond and (B) a compound generating a radical.

公开(公告)号：US11674793B2

公开(公告)日：2023-06-13

申请号：US16487349

申请日：2018-02-19

申请人： NAMICS CORPORATION

发明人： Qinghua Wang ,  Shien Ri ,  Toshiaki Enomoto

IPC分类号： G01B11/16 ,  G01B11/25

CPC分类号： G01B11/16 ,  G01B11/254

摘要： A residual thermal strain distribution measurement method of measuring a residual thermal strain distribution as residual thermal deformation in a sample generated under application of a thermal load, comprises recording images of a periodic pattern present on the surface of the sample by an image recording unit at a first temperature and a sample formation temperature at which the sample is formed, generating moire fringes based on each recorded image of the periodic pattern, calculating a phase of the moire fringes for the sample at the first temperature, calculating a phase of the moire fringes for the sample at the sample formation temperature, acquiring a phase difference of the moire fringes at the sample formation temperature with respect to the first temperature, and calculating a residual thermal strain of the sample at the first temperature with respect to the sample formation temperature based on the acquired phase difference.

公开(公告)号：US20230143754A1

公开(公告)日：2023-05-11

申请号：US17912204

申请日：2021-03-15

申请人： NAMICS CORPORATION

发明人： Ayako SATO ,  Rieko NAGATA

IPC分类号： C08F122/14

CPC分类号： C08F122/14

摘要： An object of the present invention is to provide a photocurable resin composition which is quickly cured through anionic polymerization even by irradiation with ultraviolet light from a ultraviolet light-emitting diode in the UV-A or UV-B range, the resin composition suitable for the manufacture of electronic components.
The photocurable resin composition of the present invention comprises (a) a 2-methylene-1,3-dicarbonyl compound, (b) an ionic photo base generator and (c) a photo-sensitizer. The 2-methylene-1,3-dicarbonyl compound is a compound comprising at least one specific structural unit, and the ionic photo base generator is a salt comprising specific anion (i) and cation (ii).

公开(公告)号：US11634615B2

公开(公告)日：2023-04-25

申请号：US16614351

申请日：2018-05-18

申请人： NAMICS CORPORATION

发明人： Fuminori Arai ,  Kazuki Iwaya

IPC分类号： C09J129/12 ,  C08K3/013 ,  C08J5/18 ,  C08K5/00 ,  C08K5/17 ,  H01L23/10 ,  C08J5/24

摘要： A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.

公开(公告)号：US11623813B2

公开(公告)日：2023-04-11

申请号：US17435198

申请日：2020-02-06

申请人： NAMICS CORPORATION

发明人： Hiroki Myodo ,  Masaaki Hoshiyama

IPC分类号： B65D83/00

摘要： There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

公开(公告)号：US20230013549A1

公开(公告)日：2023-01-19

申请号：US17782211

申请日：2020-09-25

申请人： NAMICS CORPORATION

发明人： Pawel Czubarow ,  Daisuke Hashimoto ,  Yoshitaka Kamata ,  Toshiyuki Sato

IPC分类号： H01C7/10 ,  H01C7/102 ,  H01C17/065

摘要： Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).