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公开(公告)号:US10941280B2
公开(公告)日:2021-03-09
申请号:US15528739
申请日:2015-09-01
申请人: NAMICS Corporation
发明人: Tomoya Yamazawa , Haruyuki Yoshii
IPC分类号: C08L63/00 , C09J163/00 , H01L23/00 , H01L21/56 , C08K3/22 , H01L23/29 , H01L23/31 , H01L23/28 , C08K9/06 , C08K3/36
摘要: Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).
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公开(公告)号:US20150175856A1
公开(公告)日:2015-06-25
申请号:US14416045
申请日:2013-05-15
申请人: NAMICS Corporation
IPC分类号: C09J163/00 , C08K5/5419 , H01L23/29 , C08K3/36
CPC分类号: H01L23/295 , C08G59/245 , C08G59/50 , C08K3/36 , C08K5/09 , C08K5/18 , C08K5/5419 , C08L63/00 , C09J11/04 , C09J11/06 , C09J163/00 , H01L23/293 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
摘要翻译: 本发明的目的是提供:具有优异的PCT(压力锅试验)电阻的液体密封材料; 以及通过使用液体密封材料密封待密封部件而获得的电子部件。 本发明的液体密封材料包含(A)液体环氧树脂,(B)固化剂,(C)二氧化硅填料和(D)偶联剂,其特征在于二氧化硅填料中的硼含量 (C)的平均值为1-50ppm。
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公开(公告)号:US09805998B2
公开(公告)日:2017-10-31
申请号:US14416045
申请日:2013-05-15
申请人: NAMICS Corporation
IPC分类号: H01L23/29 , C08L63/00 , C09J163/00 , C08K3/36 , C08K9/06 , C08K5/5419 , C08G59/24 , C08G59/50 , C09J11/04 , C09J11/06 , C08K5/09 , C08K5/18
CPC分类号: H01L23/295 , C08G59/245 , C08G59/50 , C08K3/36 , C08K5/09 , C08K5/18 , C08K5/5419 , C08L63/00 , C09J11/04 , C09J11/06 , C09J163/00 , H01L23/293 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
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公开(公告)号:US09748158B2
公开(公告)日:2017-08-29
申请号:US15190765
申请日:2016-06-23
申请人: NAMICS Corporation
IPC分类号: H01L23/29 , C08L63/00 , C09J163/00 , C08K3/36 , C08K9/06 , C08K5/5419 , C08G59/24 , C08G59/50 , C09J11/04 , C09J11/06 , C08K5/09 , C08K5/18
CPC分类号: H01L23/295 , C08G59/245 , C08G59/50 , C08K3/36 , C08K5/09 , C08K5/18 , C08K5/5419 , C08L63/00 , C09J11/04 , C09J11/06 , C09J163/00 , H01L23/293 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.
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