Invention Grant
- Patent Title: Encapsulated magnetron
-
Application No.: US14338779Application Date: 2014-07-23
-
Publication No.: US09754771B2Publication Date: 2017-09-05
- Inventor: Brian T. West , Roger M. Johnson , Michael S. Cox
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01J25/50
- IPC: H01J25/50 ; H01J37/34 ; H01J23/10 ; H03B9/10 ; H03C5/04 ; H03C3/32 ; H01J23/05 ; H01J25/587
Abstract:
Embodiments of the present invention generally provide a magnetron that is encapsulated by a material that is tolerant of heat and water. In one embodiment, the entire magnetron is encapsulated. In another embodiment, the magnetron includes magnetic pole pieces, and the magnetic pole pieces are not covered by the encapsulating material.
Public/Granted literature
- US20150048735A1 ENCAPSULATED MAGNETRON Public/Granted day:2015-02-19
Information query
