Invention Grant
- Patent Title: Lead-free solder alloy, solder material and joined structure
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Application No.: US15120937Application Date: 2015-02-19
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Publication No.: US09764430B2Publication Date: 2017-09-19
- Inventor: Atsushi Irisawa , Rie Wada
- Applicant: KOKI Company Limited
- Applicant Address: JP Tokyo
- Assignee: KOKI Company Limited
- Current Assignee: KOKI Company Limited
- Current Assignee Address: JP Tokyo
- Agency: The Webb Law Firm
- Priority: JP2014-033234 20140224
- International Application: PCT/JP2015/054581 WO 20150219
- International Announcement: WO2015/125855 WO 20150827
- Main IPC: H01L23/14
- IPC: H01L23/14 ; B23K35/36 ; B23K35/26 ; B23K35/02 ; C22C13/02 ; H05K3/34 ; H01L23/00 ; B23K101/40
Abstract:
Provided are a lead-free solder alloy which consists of Sb in an amount of more than 3.0% but 10% or less by mass, and the balance including Sn, and others.
Public/Granted literature
- US20160368104A1 Lead-Free Solder Alloy, Solder Material and Joined Structure Public/Granted day:2016-12-22
Information query
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