-
公开(公告)号：US12138714B2
公开(公告)日：2024-11-12
申请号：US16979165
申请日：2019-03-08
Applicant: ORIGIN COMPANY, LIMITED , KOKI COMPANY LIMITED
Inventor： Arisa Shiraishi , Naoto Ozawa , Takayuki Suzuki , Mitsuyasu Furusawa
IPC: B23K35/36 , B23K35/26 , B23K35/362 , C22C13/00 , B23K101/42
Abstract: The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.
-
公开(公告)号：US11833621B2
公开(公告)日：2023-12-05
申请号：US17052318
申请日：2019-04-27
Applicant: KOKI COMPANY LIMITED
Inventor： Kazuhiro Yukikata , Noriyoshi Uchida
IPC: B23K35/362 , B23K35/36 , B23K35/26 , C22C13/00 , B22F1/10
CPC classification number: B23K35/3616 , B22F1/10 , B23K35/262 , B23K35/362 , B23K35/3612 , C22C13/00
Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
-
公开(公告)号：US11825612B2
公开(公告)日：2023-11-21
申请号：US16615551
申请日：2017-10-02
Applicant: KOKI Company Limited
Inventor： Mitsuyasu Furusawa
IPC: B23K35/365 , H05K3/34 , B23K35/36
CPC classification number: H05K3/3485 , B23K35/365 , B23K35/3618
Abstract: A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.
-
公开(公告)号：US20230103270A2
公开(公告)日：2023-03-30
申请号：US17052318
申请日：2019-04-27
Applicant: KOKI COMPANY LIMITED
Inventor： Kazuhiro Yukikata , Noriyoshi Uchida
IPC: B23K35/36 , B23K35/362 , B23K35/26 , C22C13/00
Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
-
公开(公告)号：US20200187363A1
公开(公告)日：2020-06-11
申请号：US16615551
申请日：2017-10-02
Applicant: KOKI COMPANY LIMITED
Inventor： Mitsuyasu FURUSAWA
IPC: H05K3/34 , B23K35/365 , B23K35/36
Abstract: A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.
-
Patent Agency Ranking
6.发明授权公开(公告)号：US09609762B2
公开(公告)日：2017-03-28
申请号：US14384204
申请日：2013-03-11
Applicant: KOKI Company Limited
Inventor： Kenji Arai , Mitsuyasu Furusawa , Junichi Aoki , Mayumi Takada , Munehiko Nakatsuma
CPC classification number: H05K3/3489 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K35/362 , H05K1/0346 , H05K13/0465
Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
-
公开(公告)号：US09421646B2
公开(公告)日：2016-08-23
申请号：US13876949
申请日：2011-03-09
Applicant: Atsushi Irisawa , Masashi Kashiwabara , Kenji Kondo , Masahito Hidaka
Inventor： Atsushi Irisawa , Masashi Kashiwabara , Kenji Kondo , Masahito Hidaka
CPC classification number: B23K35/262 , B23K35/0244 , B23K35/025 , B23K35/3616 , B23K35/3618 , B23K35/362 , C22C1/0483 , C22C13/00 , H05K3/1216 , H05K3/3463 , H05K3/3484 , H05K3/3489
Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained.
Abstract translation: 本发明的目的是提供一种焊膏，其能够在-40℃至150℃的100次热冲击循环中形成在焊接部分中具有抗裂纹性的电子部件的表面安装结构。 根据需要在车辆用途的发动机附近使用。 将包含胺卤素盐和二羧酸的助熔剂与Sn-Ag-Bi-In合金粉末捏合。 结果，获得了在-40℃至150℃下的100次热冲击循环中具有长的连续印刷性，焊球几乎不发生的焊膏和优异的接合能力而无裂纹。
-
公开(公告)号：US20130186519A1
公开(公告)日：2013-07-25
申请号：US13876949
申请日：2011-03-09
Applicant: Atsushi Irisawa , Masashi Kashiwabara , Kenji Kondo , Masahito Hidaka
Inventor： Atsushi Irisawa , Masashi Kashiwabara , Kenji Kondo , Masahito Hidaka
IPC: B23K35/26
CPC classification number: B23K35/262 , B23K35/0244 , B23K35/025 , B23K35/3616 , B23K35/3618 , B23K35/362 , C22C1/0483 , C22C13/00 , H05K3/1216 , H05K3/3463 , H05K3/3484 , H05K3/3489
Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained.
Abstract translation: 本发明的目的是提供一种焊膏，其能够在-40℃至150℃的100次热冲击循环中形成在焊接部分中具有抗裂纹性的电子部件的表面安装结构。 根据需要在车辆用途的发动机附近使用。 将包含胺卤素盐和二羧酸的助熔剂与Sn-Ag-Bi-In合金粉末捏合。 结果，获得了在-40℃至150℃下的100次热冲击循环中具有长的连续印刷性，焊球几乎不发生的焊膏和优异的接合能力而无裂纹。
-
公开(公告)号：US20120291921A1
公开(公告)日：2012-11-22
申请号：US13513880
申请日：2010-12-06
Applicant: Eiji Iwamura , Kazushi Gotoh , Shinsuke Nagasaka , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
Inventor： Eiji Iwamura , Kazushi Gotoh , Shinsuke Nagasaka , Takayasu Yoshioka , Masayoshi Utsuno , Atsuo Nakamura , Teruo Okochi , Masaki Sanji , Takuji Sukekawa , Kenshi Ikedo , Yoshiyuki Andoh , Takeshi Shirai , Kimiaki Mori , Rie Wada , Kensuke Nakanishi , Masami Aihara , Seishi Kumamoto
IPC: B23K35/363
CPC classification number: B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.
Abstract translation: 根据本发明的一个方面的用于焊膏的焊剂包括通过使具有C6-C15烷基的（甲基）丙烯酸酯和除上述（甲基）丙烯酸酯之外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸类树脂; 和松香。 当松香的重量为1时，丙烯酸树脂的重量比为0.5以上且1.2以下，通过施加10Pa以上且150Pa以下的剪切力使焊膏的焊剂流动，或 减。
-
公开(公告)号：USD580247S1
公开(公告)日：2008-11-11
申请号：US29305629
申请日：2008-03-25
Applicant: Takeshi Taniguchi , Hitoshi Tsuzuki , Akira Onose
Designer： Takeshi Taniguchi , Hitoshi Tsuzuki , Akira Onose
-
-
-
-
-
-
-
-
-
Search Results
143
records
(took 0.023 seconds)
