Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US14084839Application Date: 2013-11-20
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Publication No.: US09768039B2Publication Date: 2017-09-19
- Inventor: Kazuhiro Aiura , Norihiro Ito , Hidetoshi Nakao , Kazuyoshi Shinohara , Satoru Tanaka , Yuki Yoshida , Meitoku Aibara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2012-255566 20121121; JP2013-205418 20130930
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687

Abstract:
A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate.
Public/Granted literature
- US20140137902A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2014-05-22
Information query
IPC分类: