Invention Grant
- Patent Title: Method to fabricate GaN-based vertical-cavity surface-emitting devices featuring silicon-diffusion defined current blocking layer
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Application No.: US14876817Application Date: 2015-10-07
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Publication No.: US09819152B2Publication Date: 2017-11-14
- Inventor: Ping-Hui Yeh , Meng-Chun Yu , Jia-Huan LIn , Ching-Chin Huang
- Applicant: Ping-Hui Yeh , Meng-Chun Yu , Jia-Huan LIn , Ching-Chin Huang
- Applicant Address: TW Taipei
- Assignee: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: TW Taipei
- Main IPC: H01S5/183
- IPC: H01S5/183 ; H01L33/00 ; H01L33/06 ; H01L33/10 ; H01L33/14 ; H01L33/32 ; H01L33/46 ; H01S5/343

Abstract:
This invention discloses a method for the fabrication of GaN-based vertical cavity surface-emitting devices featuring a silicon-diffusion defined current blocking layer (CBL). Such devices include vertical-cavity surface-emitting laser (VCSEL) and resonant-cavity light-emitting diode (RCLED). The silicon-diffused P-type GaN region can be converted into N-type GaN and thereby attaining a current blocking effect under reverse bias. And the surface of the silicon-diffused area is flat so the thickness of subsequent optical coating is uniform across the emitting aperture. Thus, this method effectively reduces the optical-mode field diameter of the device, significantly decreases the spectral width of LED, and produces single-mode emission of VCSEL.
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