Invention Grant
- Patent Title: Modular printed circuit board
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Application No.: US14496876Application Date: 2014-09-25
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Publication No.: US09829915B2Publication Date: 2017-11-28
- Inventor: Kevin E. Wells , Richard C. Stamey
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/42 ; G06F1/16 ; H05K3/36 ; H05K1/02 ; H05K7/02 ; H05K3/34 ; H05K1/14

Abstract:
Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20150373847A1 MODULAR PRINTED CIRCUIT BOARD Public/Granted day:2015-12-24
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