Invention Grant
- Patent Title: Chip fabric interconnect quality on silicon
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Application No.: US14998200Application Date: 2015-12-24
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Publication No.: US09891282B2Publication Date: 2018-02-13
- Inventor: Lakshminarayana Pappu , Robert P. Adler , Suketu U. Bhatt , Robert De Gruijl , Kah Meng Yeem
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/3177 ; H03K19/177 ; H03K19/21

Abstract:
Described is a signature accumulator with a first set of logic devices, a second set of logic devices, and a memory device. The first set of logic devices includes compaction logic that couples an N-bit input bus to a K-bit first intermediate bus. The second set of logic devices includes commutative arithmetic operation logic that couples both the K-bit first intermediate bus and a K-bit signature bus to a K-bit second intermediate bus. The memory storage device includes a storage element that couples the K-bit second intermediate bus to the K-bit signature bus. The K-bit signature bus is also coupled to a valid-data input signal path.
Public/Granted literature
- US20170184666A1 Chip fabric interconnect quality on silicon Public/Granted day:2017-06-29
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