Invention Grant
- Patent Title: MRAM devices and methods of forming the same
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Application No.: US15080569Application Date: 2016-03-24
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Publication No.: US09972771B2Publication Date: 2018-05-15
- Inventor: Chun-Chieh Mo , Shih-Chi Kuo , Tsung-Hsien Lee , Wu-An Weng , Chung-Yu Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L43/08
- IPC: H01L43/08 ; H01L43/02 ; H01L43/12

Abstract:
MRAM devices and methods of forming the same are provided. One of the MRAM devices includes a dielectric layer, a resistance variable memory cell and a conductive layer. The dielectric layer is over a substrate and has an opening. The resistance variable memory cell is in the opening and includes a first electrode, a second electrode and a magnetic tunnel junction layer between the first electrode and the second electrode. The conductive layer fills a remaining portion of the opening and is electrically connected to one of the first electrode and the second electrode of the resistance variable memory cell.
Public/Granted literature
- US20170279036A1 MRAM DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2017-09-28
Information query
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