Invention Application
- Patent Title: APPARATUS COMPRISING A POWER MODULE ATTACHED THROUGH AN ISOLATION LAYER TO AN ELECTRIC MACHINE AND CORRESPONDING MANUFACTURING METHOD
- Patent Title (中): 包含通过隔离层连接到电机的功率模块的装置和相应的制造方法
-
Application No.: PCT/EP2016/055420Application Date: 2016-03-14
-
Publication No.: WO2016156022A1Publication Date: 2016-10-06
- Inventor: BICAKCI, Aylin , OSTERWALD, Frank , RUDZKI, Jacek , EISELE, Ronald , FILIPIAK-RESSEL, Tino , ULRICH, Holger , OLESEN, Klaus , BREDTMANN, Rüdiger , MÜHLFELD, Ole
- Applicant: DANFOSS SILICON POWER GMBH
- Applicant Address: Husumer Str. 251 24941 Flensburg DE
- Assignee: DANFOSS SILICON POWER GMBH
- Current Assignee: DANFOSS SILICON POWER GMBH
- Current Assignee Address: Husumer Str. 251 24941 Flensburg DE
- Agency: WHITING, Gary
- Priority: DE10 20150330
- Main IPC: H02K11/33
- IPC: H02K11/33 ; H01L25/07 ; H01L23/053 ; H01L23/24
Abstract:
An apparatus comprises a power module (1) and an electric machine (e.g. a multiphase motor of a vehicle), wherein the power module (1) comprises a plurality of components (4) attached to a circuit layer (5) and wherein the power module (1) and the electric machine (e.g. its end bearing plate (2)) are physically connected by an isolation layer (7), the isolation layer (7) electrically insulating the power module (1) and the circuit layer (5) from the electric machine. The power module (1) is thus an integral part of the electric machine. The circuit layer (5) may be a lead frame. The plurality of components (4) may be attached to the circuit layer (5) by sintering or soldering. The isolation layer (7) may be an epoxy resin filled with thermally conductive fillers. An encapsulation layer may be provided, by filling a resin (12) within additional resin walls (dam) (11). A multi-terminal socket (15) with a plurality of terminals (13) mounted in a plastic holder (14) may be provided, configured perpendicular to the circuit layer (5).
Information query