公开(公告)号：WO2022229279A1

公开(公告)日：2022-11-03

申请号：PCT/EP2022/061244

申请日：2022-04-27

申请人： DANFOSS SILICON POWER GMBH

发明人： RUDZKI, Jacek ,  PAULSEN, Lars ,  FILIPIAK-RESSEL, Tino

IPC分类号： B29C45/14 ,  B29C70/72 ,  H01L21/56 ,  B29C33/14

摘要： A semiconductor power module (10) comprising one or more semiconductors (4) placed on a substrate (7) is disclosed. The power module (10) comprises a contact formed from a contact pin (6) provided with a plastic sleeve (5) having a central portion (13). Therein the contact pin (6) comprises a longitudinal axis (Y). The plastic sleeve (5) encases a portion of the contact pin (6). The distal portion of the sleeve (5) comprises a plastically deformed zone (8). The sleeve (5) encases the proximal portion of the contact pin (6), wherein the sleeve (5) is continuous from its distal portion to its proximal portion and the proximal portion is in direct contact with the substrate (7) or a structure (9) being in direct contact with the substrate (7).

公开(公告)号：WO2020094411A1

公开(公告)日：2020-05-14

申请号：PCT/EP2019/079023

申请日：2019-10-24

申请人： DANFOSS SILICON POWER GMBH

发明人： MÜLLER, Zeno ,  FILIPIAK-RESSEL, Tino ,  BEER, Holger ,  PAULSEN, Lars ,  STREIBEL, Alexander

IPC分类号： B29C45/14 ,  B29L31/34 ,  H01L21/56

摘要： A mold tool (1) is described for molding a semiconductor power module having an electrical contact pin (2) which comprises an electrical contact portion (3) for contacting a substrate (4) with another electrical component. The pin (2) comprises a protruding portion (5) being a top-sided pin connector. The mold tool (1) comprises a first (6) and a second mold die which, when brought together for molding, form a cavity to be filled with a mold compound for encapsulating electrical components of the semiconductor power module, and a recess (7) in the first die 6 which communicates with the cavity within the second die. The recess (7) is filled with a cushion-like soft material (8) into which the top-sided pin connector is pushed thereinto and completely surrounded by the soft material so that a sealing means is formed that prevents any contamination of the electrical contact portion (3) of the pin (2) by the molding compound introduced into the cavity. Furthermore, a method of manufacturing such a semiconductor power module is described.

公开(公告)号：WO2016156022A1

公开(公告)日：2016-10-06

申请号：PCT/EP2016/055420

申请日：2016-03-14

申请人： DANFOSS SILICON POWER GMBH

发明人： BICAKCI, Aylin ,  OSTERWALD, Frank ,  RUDZKI, Jacek ,  EISELE, Ronald ,  FILIPIAK-RESSEL, Tino ,  ULRICH, Holger ,  OLESEN, Klaus ,  BREDTMANN, Rüdiger ,  MÜHLFELD, Ole

IPC分类号： H02K11/33 ,  H01L25/07 ,  H01L23/053 ,  H01L23/24

CPC分类号： H01L23/053 ,  H01L23/24 ,  H01L23/492 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1811 ,  H01L2924/186 ,  H02K11/33 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/37099

摘要： An apparatus comprises a power module (1) and an electric machine (e.g. a multiphase motor of a vehicle), wherein the power module (1) comprises a plurality of components (4) attached to a circuit layer (5) and wherein the power module (1) and the electric machine (e.g. its end bearing plate (2)) are physically connected by an isolation layer (7), the isolation layer (7) electrically insulating the power module (1) and the circuit layer (5) from the electric machine. The power module (1) is thus an integral part of the electric machine. The circuit layer (5) may be a lead frame. The plurality of components (4) may be attached to the circuit layer (5) by sintering or soldering. The isolation layer (7) may be an epoxy resin filled with thermally conductive fillers. An encapsulation layer may be provided, by filling a resin (12) within additional resin walls (dam) (11). A multi-terminal socket (15) with a plurality of terminals (13) mounted in a plastic holder (14) may be provided, configured perpendicular to the circuit layer (5).

摘要翻译： 一种装置包括功率模块（1）和电机（例如，车辆的多相电机），其中功率模块（1）包括附接到电路层（5）的多个部件（4），并且其中功率 模块（1）和电机（例如其端承板（2））通过隔离层（7）物理连接，隔离层（7）将功率模块（1）和电路层（5）电绝缘， 从电机。 因此，功率模块（1）是电机的组成部分。 电路层（5）可以是引线框架。 多个组件（4）可以通过烧结或焊接附接到电路层（5）。 隔离层（7）可以是填充有导热填料的环氧树脂。 可以通过在另外的树脂壁（坝）（11）内填充树脂（12）来提供封装层。 可以提供垂直于电路层（5）构造的具有安装在塑料保持器（14）中的多个端子（13）的多端子插座（15）。