公开(公告)号：EP0114857A1

公开(公告)日：1984-08-08

申请号：EP83902435.0

申请日：1983-08-02

申请人： BURROUGHS CORPORATION (a Michigan corporation) ,  BURROUGHS MACHINES LIMITED

发明人： WERY, M., Jean, Claude ,  JEHAY, Michel ,  JOB, Andre

IPC分类号： B23K11 ,  B23K20 ,  H05K3 ,  H05K1

CPC分类号： H01L24/85 ,  B23K11/34 ,  B23K20/005 ,  B23K20/24 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45014 ,  H01L2224/4809 ,  H01L2224/48096 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K1/116 ,  H05K1/141 ,  H05K3/225 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2203/1115 ,  Y10T29/49124 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49204 ,  Y10T29/49732 ,  Y10T156/1052 ,  Y10T156/1092 ,  Y10T156/1339 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/45099

摘要： An apparatus in the form of a multilayered pad (P1,P2) is provided which has an adhesive layer (32) over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet (46) of pads into individual pads (P1,P2), placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads (P1,P2) to bond them to the board, and stitching (welding) wire (24) to a succession of pads (p1,P2) to complete a series of new connections. Some pads (P1) include plated-through-holes (40) enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.

摘要翻译： 提供了一种在多层垫（P1，P2）的形式的装置，它具有在一个面全部，它响应于加热所以DASS冲模垫可以通过热结合到的表面的至少一部分，以粘合剂层（32） 印刷电路板。 垫的另一面包括不锈钢到哪个镍丝的层可被缝合，或焊接。 雅丁到本发明的方法包括切割垫成单独的焊盘（P1，P2）的片材（46），放置垫的复数，粘合剂面朝下，印刷电路板的表面上，加热垫片（P1，P2 ）将它们结合到电路板上，和缝合（焊接）金属丝（24）的焊盘（P1连续，P2），从而完成一系列的新的连接。 一些垫（P1）包括镀通孔（40），使连接被从焊盘到在板上，并安装在由使用的流焊技术中的孔部件的现有的电路完成。