公开(公告)号：EP1474266B1

公开(公告)日：2007-04-04

申请号：EP03706280.9

申请日：2003-02-05

申请人： Infineon Technologies AG

发明人： HOSSEINI, Khalil

IPC分类号： B23K20/00 ,  B23K20/10 ,  B23K26/20

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  B23K26/20 ,  B23K2201/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05655 ,  H01L2224/32245 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48655 ,  H01L2224/48755 ,  H01L2224/48855 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85099 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/45644 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/2075

摘要： The invention relates to a method for wire bonding and a method for the production of a bonding connection. A bonding point (2, 20) is heated by means of a laser beam (4) originating from a laser. The arrangement (1) comprises a wedge-wedge-ultrasound-bonding device with a bonding needle (5), a copper or aluminium bonding wire guide (7) and a copper or aluminium wire (8) for a wedge-wedge-ultrasound-bonding method and at least one of the bonding points (2, 20) displays a hard metal covering (6).

公开(公告)号：EP1654753A2

公开(公告)日：2006-05-10

申请号：EP04780916.5

申请日：2004-08-11

申请人： Advanced Interconnect Technologies Limited

发明人： ISLAM, Shafidul ,  LAU, Daniel, Kwok ,  SAN ANTONIO, Romarico Santos ,  SUBAGIO, Anang ,  MCKERREGHAN, Michael Hannan ,  LITILIT, Edmunda, Gut-Omen

IPC分类号： H01L21/00

CPC分类号： H01L23/3114 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L24/86 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/81801 ,  H01L2224/85001 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45139 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

摘要： A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed proximate the die (14). Extending from opposite ends of the interposer (64) are a board connecting post (70) and a support post (74). A bond site (78) is formed on a surface of the interposer (64) opposite the support post (74). Each of the leads (60) is electrically connected to an associated input/output (I/O) pad (80) on the die (14) via wirebonding, tape bonding, or flip-chip attachment to the bond site (78). Where wirebonding is used, a wire electrically connecting the I/O pad (80) to the bond site (78) may be wedge bonded to both the I/O pad (80) and the bond site (78). The support post (74) provides support to the end (68) of the interposer (64) during the bonding and coating processes.(FIG. 3).

公开(公告)号：EP0953207A1

公开(公告)日：1999-11-03

申请号：EP97950330.0

申请日：1997-12-24

申请人： Ford Motor Company ,  FORD MOTOR COMPANY LIMITED

发明人： PHAM, Cuong, Van ,  BAKER, Jay, DeAvis ,  NUNO, Rose, Lynda

IPC分类号： H01L21 ,  B23K20

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/06135 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/49175 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85001 ,  H01L2224/8502 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

摘要： A method is disclosed for on-line doping of metallic connecting wire for use in integrated circuits. The method comprises the steps of: providing a bonding apparatus (70) comprising a bonding tool (40), said bonding tool having a tip (44) through which a capillary (42) runs, such that metallic connecting wire (20) may be fed through said tip (44); extending an end of the connecting wire (20) a predetermined length beyond the tip (44) of said bonding tool (40); and forming a doped area on the end of said wire by: bringing the end of said wire into contact with dopant material (52), and applying predetermined amounts of pressure, heat, and ultrasonic vibration to said end of the wire (20) for a predetermined amount of time.

公开(公告)号：EP0408272A3

公开(公告)日：1991-12-11

申请号：EP90307447.4

申请日：1990-07-09

申请人： THE WELDING INSTITUTE

发明人： Stockham, Norman Roy

IPC分类号： H01L21/60 ,  H01L21/607

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/20759 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20754 ,  H01L2924/013 ,  H01L2924/00013

摘要： A method of bonding an electrical conductor (22,23) to a contact (25) of an integrated circuit (IC) device comprises bonding the conductor (22,23) to a support member (20) and to a contact (25) of the IC device. The conductor (22,23) is then severed to release the IC device and conductor (22,23) from the support (20). This allows the IC device to be tested while connected to the support member (20) and provides it with a conductor lead (22,23) for connection to a carrier for use.

公开(公告)号：EP0114857A1

公开(公告)日：1984-08-08

申请号：EP83902435.0

申请日：1983-08-02

申请人： BURROUGHS CORPORATION (a Michigan corporation) ,  BURROUGHS MACHINES LIMITED

发明人： WERY, M., Jean, Claude ,  JEHAY, Michel ,  JOB, Andre

IPC分类号： B23K11 ,  B23K20 ,  H05K3 ,  H05K1

CPC分类号： H01L24/85 ,  B23K11/34 ,  B23K20/005 ,  B23K20/24 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45014 ,  H01L2224/4809 ,  H01L2224/48096 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K1/116 ,  H05K1/141 ,  H05K3/225 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2203/1115 ,  Y10T29/49124 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49204 ,  Y10T29/49732 ,  Y10T156/1052 ,  Y10T156/1092 ,  Y10T156/1339 ,  H01L2924/00 ,  H01L2224/48095 ,  H01L2224/45099

摘要： An apparatus in the form of a multilayered pad (P1,P2) is provided which has an adhesive layer (32) over at least part of one face which is responsive to heat so that the pad can be bonded by heat to the surface of a printed circuit board. The other face of the pad includes a layer of stainless steel to which nickel wire can be stitched, or welded. A method according to the invention includes cutting a sheet (46) of pads into individual pads (P1,P2), placing a plurality of pads, adhesive side down, on the surface of a printed circuit board, heating the pads (P1,P2) to bond them to the board, and stitching (welding) wire (24) to a succession of pads (p1,P2) to complete a series of new connections. Some pads (P1) include plated-through-holes (40) enabling connections to be completed from the pads to existing circuitry on the boards and to components mounted in the holes by the use of flow soldering techniques.

摘要翻译： 提供了一种在多层垫（P1，P2）的形式的装置，它具有在一个面全部，它响应于加热所以DASS冲模垫可以通过热结合到的表面的至少一部分，以粘合剂层（32） 印刷电路板。 垫的另一面包括不锈钢到哪个镍丝的层可被缝合，或焊接。 雅丁到本发明的方法包括切割垫成单独的焊盘（P1，P2）的片材（46），放置垫的复数，粘合剂面朝下，印刷电路板的表面上，加热垫片（P1，P2 ）将它们结合到电路板上，和缝合（焊接）金属丝（24）的焊盘（P1连续，P2），从而完成一系列的新的连接。 一些垫（P1）包括镀通孔（40），使连接被从焊盘到在板上，并安装在由使用的流焊技术中的孔部件的现有的电路完成。

公开(公告)号：EP1904264A4

公开(公告)日：2009-05-13

申请号：EP06772731

申请日：2006-06-09

申请人： TEXAS INSTRUMENTS INC

发明人： LANGE BERNHARD P ,  KUMMERL STEVEN ALFRED

IPC分类号： B23K37/00 ,  B23K1/06 ,  B23K20/00 ,  B23K20/10

CPC分类号： B23K20/005 ,  B23K20/004 ,  B23K20/106 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： An apparatus (100) and method for bonding a wire, such as a flat rectangular cross sectioned ribbon wire (104), to a workpiece (106) in semiconductor device fabrication. The wire is fed through a passageway (116) of an ultrasonic bond capillary (102) and clamped against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The wire is bonded to the workpiece along a bonding surface (112) of the bond capillary and penetrated, at least partially, between the bonding surface and the engagement surface of the bond capillary by a cutting tool (124). The cutting tool may comprise an elongate member (126) positioned between the bonding surface and engagement surface, and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool may further comprise a ring cutter, wherein the ribbon wire passes through a ring having a cutting surface defined about an inner diameter thereof.

摘要翻译： 一种用于在半导体器件制造中将诸如扁平矩形横截面带状导线（104）的导线接合到工件（106）的设备（100）和方法。 通过超声波接合毛细管（102）的通路（116）供给金属丝，并通过可操作地联接到接合毛细管的夹爪（118）将金属丝夹紧在接合毛细管的接合表面（120）上。 导线沿着结合毛细管的结合表面（112）结合到工件并且通过切割工具（124）至少部分地穿透结合毛细管的结合表面和结合表面之间。 切割工具可以包括定位在结合表面和接合表面之间的细长构件（126），并且可以具有定位在其远端（130）处的切割刀片（128）。 切割工具可以进一步包括环形切割器，其中带状线穿过具有围绕其内径限定的切割表面的环。

公开(公告)号：EP1654753A4

公开(公告)日：2009-01-21

申请号：EP04780916

申请日：2004-08-11

申请人： ADVANCED INTERCONNECT TECH LTD

发明人： ISLAM SHAFIDUL ,  LAU DANIEL KWOK ,  SAN ANTONIO ROMARICO SANTOS ,  SUBAGIO ANANG ,  MCKERREGHAN MICHAEL HANNAN ,  LITILIT EDMUNDA GUT-OMEN

IPC分类号： H01L23/495 ,  H01L20060101 ,  H01L23/31

CPC分类号： H01L23/3114 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L24/86 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/81801 ,  H01L2224/85001 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/45139 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

摘要： A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed proximate the die (14). Extending from opposite ends of the interposer (64) are a board connecting post (70) and a support post (74). A bond site (78) is formed on a surface of the interposer (64) opposite the support post (74). Each of the leads (60) is electrically connected to an associated input/output (I/O) pad (80) on the die (14) via wirebonding, tape bonding, or flip-chip attachment to the bond site (78). Where wirebonding is used, a wire electrically connecting the I/O pad (80) to the bond site (78) may be wedge bonded to both the I/O pad (80) and the bond site (78). The support post (74) provides support to the end (68) of the interposer (64) during the bonding and coating processes.(FIG. 3).

公开(公告)号：EP0822264B1

公开(公告)日：2001-11-28

申请号：EP97250223.1

申请日：1997-07-29

申请人： Tanaka Denshi Kogyo Kabushiki Kaisha

发明人： Kikuchi, Teruo, c/o Mitaka Factory ,  Ishii, Mitsuyoshi, c/o Tanaka Kikinzoku Int. K.K.

IPC分类号： C22C5/02 ,  H01L21/607

CPC分类号： H01L24/85 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01203 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10S228/904 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01004 ,  H01L2224/45124 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/00015 ,  H01L2224/45139 ,  H01L2224/45164 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006

公开(公告)号：EP0800433B1

公开(公告)日：1999-10-20

申请号：EP95938352.2

申请日：1995-11-29

申请人： ROBERT BOSCH GMBH

发明人： ALTPETER, Arno ,  RIEDMÜLLER, Franz ,  REINOLD, Manfred

IPC分类号： B23K20/10 ,  B23K20/00

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01058 ,  H01L2924/01076 ,  H01L2224/45099

摘要： The invention concerns a method of testing connections produced using ultrasonic wire bonding, the method calling for the strength of the connection to be measured and taken as the parameter determining the quality of the bond. The invention proposes that the speed, or change with time, of the deformation of the wire and the change with time of the bond wedge size are measured during the bonding operation as the parameters determining the strength of the connection and compared with predefined quality-standard data stored in a process-control module. This enables the strength of each individual connection to be tested without interrupting the process or wasting time.

公开(公告)号：EP0822264A1

公开(公告)日：1998-02-04

申请号：EP97250223.1

申请日：1997-07-29

申请人： Tanaka Denshi Kogyo Kabushiki Kaisha

发明人： Kikuchi, Teruo, c/o Mitaka Factory ,  Ishii, Mitsuyoshi, c/o Tanaka Kikinzoku Int. K.K.

IPC分类号： C22C5/02 ,  H01L21/607

CPC分类号： H01L24/85 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01203 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10S228/904 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/00014 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01004 ,  H01L2224/45124 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/00015 ,  H01L2224/45139 ,  H01L2224/45164 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006

摘要： A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm 2 and an elongation of 1 to 3%. The gold alloy wire has a gold purity of not less than 99.9% or further comprises 0.2 to 5.0% by weight of at least one element selected from the group consisting of Pd, Ag and Pt.

摘要翻译： 一种用于楔形粘合的金合金丝，其包含1至100重量份的钙（Ca），余量为金和不可避免的杂质，所述金合金丝的拉伸强度不小于33.0kg / mm 2 伸长率为1〜3％。 金合金丝的金纯度为99.9％以上，进一步含有0.2〜5.0重量％的选自Pd，Ag，Pt的至少一种元素。